XC6VLX240T-1FFG784I

The XC6VLX240T-1FFG784I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC supplied in a 784-BBGA FCBGA package. It provides a high logic capacity with 241,152 logic elements, approximately 15.3 Mbits of embedded memory, and 400 I/O pins, all in a 784-FCBGA (29×29) surface-mount package.

This industrial-grade device operates from 950 mV to 1.05 V and is rated for an operating temperature range of -40 °C to 100 °C, with RoHS compliance for environmental compatibility.

Key Features

• Core Logic  241,152 logic elements provide substantial on-chip programmable logic capacity for complex designs.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive logic functions.
• I/O Count  400 I/O pins available to support a wide range of external interfaces and system connections.
• Package  Delivered in a 784-BBGA FCBGA package (supplier device package: 784-FCBGA, 29×29) optimized for surface-mount assembly.
• Power  Operates from a supply voltage range of 950 mV to 1.05 V to match system power domains requiring core voltages in this range.
• Temperature and Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
• Mounting  Surface mount device suitable for modern PCB assembly processes.
• Environmental Compliance  RoHS compliant to meet lead-free and restricted-substance requirements.

Unique Advantages

• High logic capacity: 241,152 logic elements enable implementation of large-scale programmable logic and complex algorithms on a single device.
• Significant on-chip memory: Approximately 15.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 400 I/O pins provide flexibility to interface with multiple peripherals and system components without additional multiplexing hardware.
• Industrial temperature range: Rated from -40 °C to 100 °C to support deployment in demanding thermal environments.
• Compact, assembly-ready package: 784-FCBGA (29×29) surface-mount package balances density and board-level integration for space-constrained designs.
• RoHS compliant: Meets environmental and regulatory requirements for lead-free manufacturing and restricted substances.

Why Choose XC6VLX240T-1FFG784I?

The XC6VLX240T-1FFG784I combines substantial programmable logic, embedded memory, and a high I/O count in a compact 784-FCBGA package, making it a suitable choice where on-chip capacity and robust environmental performance are required. Its industrial temperature rating and RoHS compliance support long-term deployment in regulated and temperature-challenging applications.

This device fits designs that need high-density logic and memory integration while maintaining a compact board footprint and meeting industrial-grade environmental requirements.

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