XC6VLX240T-2FF784I

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 15335424 241152 784-BBGA, FCBGA

Quantity 166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-2FF784I – Virtex®-6 LXT FPGA, 784-FCBGA (29×29)

The XC6VLX240T-2FF784I is a high-density Virtex®-6 LXT Field Programmable Gate Array (FPGA) offered in a 784-FCBGA package. It delivers substantial on-chip logic and embedded memory capacity with broad I/O count and an industrial operating temperature range.

This device is designed for applications that require large programmable logic capacity, significant embedded RAM, and extensive external interfacing while meeting industrial temperature and RoHS compliance requirements.

Key Features

  • High logic capacity — 241,152 logic elements to implement complex digital functions and large-scale FPGA designs.
  • Embedded memory — Approximately 15.3 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • Rich I/O — 400 user I/Os for extensive peripheral and system connectivity without external multiplexing.
  • Power supply — Core voltage range from 950 mV to 1.05 V to support the device’s core operating requirements.
  • Package and mounting — 784-FCBGA (29×29) package in a surface-mount format for compact board-level integration.
  • Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental compliance — RoHS compliant, meeting common lead-free environmental requirements.

Unique Advantages

  • Large programmable resource pool: 241,152 logic elements enable implementation of complex algorithms and wide data-path designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • Extensive external interfacing: 400 I/Os facilitate direct connection to numerous peripherals, sensors, and high-speed interfaces.
  • Industrial reliability: −40 °C to 100 °C operating range and industrial grade designation help ensure stable operation in challenging thermal environments.
  • Compact board footprint: 784-FCBGA (29×29) surface-mount package supports dense PCB layouts while providing high pin count.
  • Regulatory suitability: RoHS compliance supports adherence to lead-free environmental standards.

Why Choose XC6VLX240T-2FF784I?

The XC6VLX240T-2FF784I combines high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. It is well suited for designs that require significant on-chip resources and reliable operation across a wide temperature range.

This part is a fit for development teams and procurement groups targeting scalable, robust FPGA implementations where integration density, on-chip memory capacity, and environmental compliance are important selection criteria.

Request a quote or submit a purchase inquiry for the XC6VLX240T-2FF784I to get pricing and availability information tailored to your project needs.

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