XC6VLX240T-2FFG1156I

The XC6VLX240T-2FFG1156I is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 1156-FCBGA package. It provides high logic density and substantial on-chip memory combined with a large I/O count for demanding industrial applications.

Key attributes include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 600 user I/Os, an industrial operating temperature range of -40 °C to 100 °C, and a supply range of 0.95 V to 1.05 V, making it suitable for robust, high-density designs.

Key Features

• Core Capacity 241,152 logic elements to support complex, high-density digital designs and large-scale programmable logic implementations.
• Embedded Memory Approximately 15.3 Mbits of on-chip RAM to handle data buffering, state storage, and algorithmic working memory without external memory dependence.
• I/O Count 600 user I/Os enabling broad connectivity for parallel interfaces, multiple buses, and mixed-signal front-end interconnects.
• Package & Mounting 1156-BBGA / 1156-FCBGA (35 × 35 mm) surface-mount package for high-pin-count board-level integration.
• Power Supported core supply range from 0.95 V to 1.05 V to match system power domains and regulator designs.
• Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C for deployment in harsh environments.
• Compliance RoHS compliant to meet standard environmental regulations for lead-free assembly.

Typical Applications

• Industrial Automation and Control — The device’s industrial temperature rating and large I/O count support robust control systems, PLCs, and factory automation interfaces.
• High-density Signal Processing — Large logic capacity and substantial embedded memory enable parallel processing and complex algorithm implementation for data acquisition and real-time processing.
• Custom I/O and Interface Bridging — 600 I/Os allow flexible protocol bridging, multi-channel interface aggregation, and custom peripheral interfacing on a single device.

Unique Advantages

• High Logic Integration: 241,152 logic elements reduce the need for multiple discrete devices, simplifying board design and lowering BOM complexity.
• Significant On-chip Memory: Approximately 15.3 Mbits of embedded RAM supports buffering and algorithm state without immediate dependence on external memory.
• Extensive I/O Capability: 600 user I/Os enable broad connectivity for parallel data paths, multiple interfaces, and high-channel-count systems.
• Industrial Reliability: Rated for -40 °C to 100 °C operation and offered in a robust surface-mount FCBGA package suitable for industrial deployments.
• Flexible Power Integration: Core supply range of 0.95 V–1.05 V aligns with modern power rail designs for efficient integration into multi-rail systems.
• Environmentally Compliant: RoHS compliance supports lead-free manufacturing and regulatory needs.

Why Choose XC6VLX240T-2FFG1156I?

The XC6VLX240T-2FFG1156I delivers a balance of high logic density, substantial embedded memory, and extensive I/O in an industrial-grade FCBGA package. Its specification set targets designers who require a single-device solution for complex, high-channel-count, and high-performance programmable logic tasks.

For projects demanding scalable logic resources and robust environmental performance, this Virtex®-6 LXT device provides a compact, high-capacity platform from a recognized FPGA manufacturer, enabling long-term deployment in industrial and demanding system designs.

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