XC6VLX240T-3FF1759C

The XC6VLX240T-3FF1759C is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 1759-ball FCBGA surface-mount package. It delivers a large fabric of programmable logic, substantial on-chip RAM, and a high count of user I/O for complex digital designs.

Targeted at applications that require high logic density and extensive I/O connectivity, this commercial-grade device provides deterministic supply and thermal operating points for embedded and system-level designs.

Key Features

• Core Logic: Approximately 241,152 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory: Approximately 15.3 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage.
• I/O Capacity: 720 user I/O pins to support extensive interfacing and high-channel-count systems.
• Power Supply: Core voltage supply range of 0.95 V to 1.05 V for defined power budgeting and regulator design.
• Package & Mounting: 1759-FCBGA package (42.5 × 42.5 mm) in a surface-mount format for high-density board integration.
• Temperature & Grade: Commercial-grade device rated for 0°C to 85°C operating temperature.
• Compliance: RoHS compliant for environmental regulatory alignment.

Typical Applications

• High‑density digital signal processing: Use the large logic array and embedded RAM for real-time DSP algorithms and pipeline implementations.
• Interface aggregation and protocol bridging: Leverage 720 I/Os to consolidate multiple high-speed interfaces and manage complex protocol conversions.
• Hardware acceleration and prototyping: Implement custom accelerators or system prototypes that require significant logic resources and on-chip memory.
• Control and I/O management: Deploy in systems that need extensive parallel I/O control and deterministic core-voltage operation.

Unique Advantages

• High logic capacity: Approximately 241,152 logic elements enable large-scale functional integration on a single device, reducing system-level component count.
• Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM supports deep buffering and local data storage without external memory in many use cases.
• Extensive I/O resources: 720 user I/O pins simplify board design when connecting numerous peripherals or interfaces.
• Compact, high-pin FCBGA package: The 1759-FCBGA (42.5 × 42.5 mm) package provides high interconnect density in a surface-mount form factor.
• Defined power window: 0.95 V to 1.05 V core supply range helps streamline power-supply design and thermal planning.
• Regulatory alignment: RoHS compliance supports environmental requirements during assembly and deployment.

Why Choose XC6VLX240T-3FF1759C?

The XC6VLX240T-3FF1759C positions itself as a high-capacity, commercial-grade FPGA suited to designs that demand large amounts of programmable logic, significant on-chip memory, and very high I/O counts. Its combination of resources and package density makes it a practical choice for teams building complex digital systems, interface-heavy modules, or hardware-accelerated prototypes.

Backed by AMD's Virtex®-6 LXT lineage, this device offers a balance of integration and predictable operating parameters that support scalable development and deployment across a range of embedded and system applications.

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