XC6VLX240T-3FFG1759C

The XC6VLX240T-3FFG1759C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1759-FCBGA/1759-BBGA package designed for high-density logic integration. It combines a large logic cell count with substantial on-chip RAM and a high I/O count to address complex digital designs.

Engineered for commercial applications, the device supports a core voltage range of 950 mV to 1.05 V, operates from 0 °C to 85 °C, and is RoHS compliant. The surface-mount 1759-FCBGA (42.5x42.5) package provides a compact footprint for systems requiring dense connectivity.

Key Features

• Core / Logic Capacity  241,152 logic cells to implement complex digital functions and high-density logic designs.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM (15,335,424 bits) for data buffering, lookup tables, and storage without immediate reliance on external memory.
• I/O Density  720 user I/O pins to support multiple interfaces and high-pin-count system interconnects.
• Package and Mounting  1759-FCBGA (42.5x42.5) supplier package and 1759-BBGA package case; surface-mount mounting type for compact board-level integration.
• Power  Core supply voltage range of 950 mV to 1.05 V to match system power domains.
• Operating Conditions & Compliance  Commercial grade device with operating temperature 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density digital processing  Leverage 241,152 logic cells and substantial embedded memory to implement complex signal processing and data-path logic on a single device.
• Interface aggregation and protocol bridging  Use 720 I/O to consolidate multiple interfaces and perform protocol translation or aggregation at the board level.
• Embedded controllers and custom logic  Integrate control functions and custom hardware accelerators using on-chip memory and extensive logic resources.

Unique Advantages

• High integration density: 241,152 logic cells enable consolidation of multiple functions on one FPGA, reducing external component count.
• Significant on-chip memory: Approximately 15.3 Mbits of embedded RAM lowers dependency on external memory for many designs.
• Extensive I/O capability: 720 I/O pins provide flexibility for complex interconnect, multi-interface designs, and high-pin system requirements.
• Compact FCBGA package: The 1759-FCBGA (42.5x42.5) package offers a space-efficient solution for dense board layouts.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployment.

Why Choose XC6VLX240T-3FFG1759C?

This Virtex®-6 LXT FPGA is positioned for designs that require a combination of high logic capacity, substantial embedded memory, and a large number of I/O pins in a surface-mount FCBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of commercial electronic systems.

Choose the XC6VLX240T-3FFG1759C when your project needs dense integration of custom logic, extensive on-chip memory resources, and flexible I/O configurations within a compact package.

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