XC6VLX240T-L1FF1156I

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 15335424 241152 1156-BBGA, FCBGA

Quantity 1,012 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage910 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-L1FF1156I – Virtex®-6 LXT Field Programmable Gate Array (1156-FCBGA)

The XC6VLX240T-L1FF1156I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 1156-FCBGA package. It delivers high logic capacity alongside significant embedded RAM and a large I/O count for complex, high-density designs.

Key measurable attributes include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 600 I/O, an industrial operating temperature range of -40 °C to 100 °C, and a specified voltage supply range of 910 mV to 970 mV.

Key Features

  • Logic Capacity  241,152 logic elements to implement large-scale logic and custom hardware functions.
  • Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
  • I/O Density  600 general-purpose I/O to support wide parallel interfaces and high pin-count subsystems.
  • Package  1156-FCBGA (35×35) / 1156-BBGA FCBGA package providing a compact, high-pin-count surface-mount solution.
  • Power Supply Range  Specified voltage supply from 910 mV to 970 mV to match system power rails and design requirements.
  • Thermal and Environmental  Industrial grade with operating temperature range of -40 °C to 100 °C for deployment in a wide range of environments.
  • Mounting  Surface mount package suitable for automated PCB assembly processes.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High integration density: 241,152 logic elements reduce the need for multiple discrete logic devices and simplify system architecture.
  • Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM enables local buffering and state storage without external memory in many designs.
  • Extensive I/O availability: 600 I/O support complex, parallel interfaces and multiple peripheral connections from a single device.
  • Industrial temperature range: Rated for -40 °C to 100 °C for reliable operation across a broad set of deployment conditions.
  • Compact, high-pin-count package: 1156-FCBGA (35×35) package delivers high connectivity in a surface-mount form factor suitable for modern PCB designs.
  • Clear power specification: Defined supply range of 910 mV–970 mV supports precise power budgeting and thermal planning.

Why Choose XC6VLX240T-L1FF1156I?

The XC6VLX240T-L1FF1156I positions itself as a high-capacity FPGA solution combining extensive logic resources, significant embedded memory, and a large I/O complement within a compact FCBGA package. Its industrial temperature rating and defined supply range make it suitable for designs that require measurable hardware capacity and environmental robustness.

This device is well suited for engineers and procurement teams seeking a single FPGA with measurable, verifiable specifications—high logic element count, sizable on-chip RAM, extensive I/O, and clear package and thermal characteristics—to support scalable, long-lived designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX240T-L1FF1156I.

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