XC6VLX240T-L1FFG1759I

The XC6VLX240T-L1FFG1759I is a Virtex®-6 LXT field programmable gate array (FPGA) offered in a 1759-ball FCBGA package. It provides a high-density programmable fabric with a large logic resource pool, substantial on-chip RAM, and a high I/O count, targeted for industrial-grade deployments.

Designed for systems that require dense programmable logic, extensive embedded memory, and broad I/O connectivity, this device supports designs that must operate across a wide industrial temperature range and a defined core voltage window.

Key Features

• Core Logic – 18,840 CLBs (configurable logic blocks) delivering 241,152 logic elements for implementing complex digital functions and glue logic.
• Embedded Memory – Approximately 15.3 Mbits of on-chip RAM to support data buffering, FIFOs, and distributed storage for state machines and datapaths.
• I/O Capacity – 720 user I/O pins to accommodate high-pin-count interfaces and multiple parallel buses or mixed-signal front-ends with substantial connectivity.
• Package and Mounting – 1759-ball FCBGA (1759-BBGA) surface-mount package; supplier device package specified as 1759-FCBGA (42.5 × 42.5 mm) to support compact, high-density board layouts.
• Power – Core supply range specified at 910 mV to 970 mV, enabling precise power budgeting and supply design for the programmable fabric.
• Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Regulatory – RoHS compliant, supporting environmentally preferable product design and regulatory requirements.

Typical Applications

• Industrial Control Systems – Implements complex control logic and state machines using dense logic resources and on-chip memory while meeting industrial temperature requirements.
• High-Density I/O Interfaces – Serves as a programmable bridge or protocol adapter where 720 I/Os enable multiple parallel interfaces or extensive sensor/actuator connectivity.
• Data Buffering and Processing – Uses approximately 15.3 Mbits of embedded RAM for packet buffering, streaming FIFOs, or temporary data storage in real-time processing pipelines.

Unique Advantages

• Large Logic Fabric: 241,152 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 15.3 Mbits of on-chip RAM supports deep buffering and complex datapath implementations without external memory.
• Extensive I/O Count: 720 I/Os enable high-connectivity designs, simplifying integration with external peripherals and parallel interfaces.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact High-Density Package: 1759-FCBGA (42.5 × 42.5 mm) offers a balance of miniaturization and high pin count for space-constrained, high-performance boards.
• RoHS Compliant: Facilitates designs that meet common environmental and regulatory requirements.

Why Choose XC6VLX240T-L1FFG1759I?

The XC6VLX240T-L1FFG1759I positions itself as an industrial-grade, high-density FPGA solution combining a large pool of logic elements, significant on-chip RAM, and a very high I/O count in a compact FCBGA package. These characteristics make it suitable for designs that need to consolidate complex digital functions, provide extensive connectivity, and maintain operation across a wide temperature range.

This device is well suited for engineers and procurement teams targeting robust, scalable FPGA-based subsystems where logic density, embedded memory capacity, and I/O flexibility are primary selection criteria. Its defined core voltage range and RoHS compliance support controlled power design and regulatory alignment.

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