XC6VLX240T-L1FFG784I

The XC6VLX240T-L1FFG784I is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD, delivered in a 784-ball FCBGA package. It provides a high logic element count, substantial embedded memory, and extensive I/O capability for demanding industrial designs.

With 241,152 logic elements, approximately 15.3 Mbits of on-chip RAM and 400 user I/O pins, this device is positioned for complex, high-density logic implementations that require robust I/O and on-chip storage while operating across an industrial temperature range.

Key Features

• FPGA Architecture  Virtex-6 LXT field programmable gate array architecture in the XC6VLX240T-L1FFG784I device.
• Logic Capacity  241,152 logic elements to support large-scale combinational and sequential logic designs.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive logic functions.
• I/O Resources  400 user I/O pins to accommodate extensive peripheral and signal interfacing requirements.
• Power Supply Range  Core voltage supply specified from 910 mV to 970 mV for device operation.
• Package & Mounting  784-ball FCBGA package (784-BBGA, supplier package 784-FCBGA 29×29) with surface-mount mounting for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the device’s high logic density and extensive I/O to implement complex control logic, signal aggregation and real-time processing in industrial systems.
• High-Density Data Processing  Leverage the large number of logic elements and on-chip RAM for custom data-path acceleration and buffering tasks.
• Embedded System Integration  Integrate multiple interfaces and custom logic functions on a single FPGA platform using the 400 I/O pins and significant embedded memory.

Unique Advantages

• High Logic Density:  241,152 logic elements enable consolidation of large logic designs onto a single device, reducing board-level complexity.
• Substantial On-Chip Memory:  Approximately 15.3 Mbits of RAM support buffering and memory-intensive algorithms without requiring external memory.
• Extensive I/O Count:  400 user I/Os provide flexibility for connecting peripherals, sensors and multiple serial or parallel interfaces.
• Industrial Temperature Capability:  Rated −40 °C to 100 °C for reliable operation in temperature-challenged environments.
• Compact, Surface-Mount Package:  784-FCBGA (29×29) ball grid package allows high-density board layouts while maintaining a small footprint.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious designs.

Why Choose XC6VLX240T-L1FFG784I?

This Virtex-6 LXT FPGA combines high logic capacity, considerable embedded memory and a large I/O count in a compact industrial-grade FCBGA package, making it a strong option for engineers building complex, high-density embedded and control systems. Its specified voltage and temperature ranges align with industrial deployment requirements, supporting robust operation across a wide set of conditions.

Manufactured by AMD, the XC6VLX240T-L1FFG784I is suited to teams looking to consolidate multiple functions onto a single programmable device, reduce BOM complexity and scale custom logic designs within an established FPGA platform.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX240T-L1FFG784I.