XC6VLX365T-1FFG1156C

The XC6VLX365T-1FFG1156C is a Virtex‑6 LXT Field Programmable Gate Array (FPGA) from AMD, offered in a 1156‑ball FCBGA package (35×35 mm). It provides a high logic capacity and substantial on‑chip memory along with a large number of I/O pins for designs that require dense integration and flexible I/O connectivity.

This commercial‑grade device targets designs needing significant programmable logic, embedded memory and high I/O counts while operating within standard commercial temperature and core voltage ranges.

Key Features

• Logic Capacity  Approximately 364,032 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory  Approximately 15.3 Mbits of on‑chip RAM to support data buffering, FIFOs and memory‑intensive algorithms without external memory in many cases.
• I/O Density  600 user I/O pins to accommodate wide parallel interfaces, multiple high‑pin‑count peripherals or board‑level I/O partitioning.
• Power Supply  Core voltage operating range of 0.95 V to 1.05 V; suitable for systems designed around this supply envelope.
• Package & Mounting  1156‑BBGA (1156‑FCBGA) surface‑mount package, 35×35 mm footprint for high‑density board layouts.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant construction to meet common regulatory requirements for lead‑free assemblies.

Typical Applications

• High‑density digital systems  Use the large logic element count to implement complex state machines, custom processors or large-scale digital datapaths.
• Memory‑intensive designs  Leverage approximately 15.3 Mbits of embedded RAM for buffering, packet queues or intermediate data storage within the FPGA fabric.
• I/O‑heavy interfaces  600 I/O pins support designs with multiple parallel buses, mixed I/O standards or extensive sensor and peripheral connectivity.

Unique Advantages

• High integration density: The combination of ~364,032 logic elements and ~15.3 Mbits of embedded memory reduces the need for external logic and memory components.
• Large I/O complement: 600 I/Os allow flexible partitioning of interfaces and simplify board‑level routing for complex systems.
• Compact package footprint: 1156‑FCBGA (35×35 mm) surface‑mount package optimizes board space for high‑functionality designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C and classified as commercial grade for applications within standard commercial environments.
• Regulatory readiness: RoHS compliance supports lead‑free assembly processes and environmental regulations.

Why Choose XC6VLX365T-1FFG1156C?

The XC6VLX365T‑1FFG1156C positions itself as a dense, I/O‑capable Virtex‑6 LXT FPGA option for designs that require substantial programmable logic and embedded memory within a compact FCBGA package. Its combination of logic elements, on‑chip RAM and 600 I/Os makes it suitable for applications where integration and board‑level consolidation matter.

Engineers selecting this commercial‑grade device benefit from clear electrical and environmental parameters—core voltage 0.95–1.05 V and operating temperature 0–85 °C—along with RoHS compliance for streamlined manufacturing and regulatory alignment.

Request a quote or submit a pricing inquiry to evaluate the XC6VLX365T‑1FFG1156C for your next design project.