XC6VLX365T-2FFG1759C

The XC6VLX365T-2FFG1759C is a Virtex®-6 LXT family field programmable gate array designed for high-density, commercial-grade digital designs. It combines a large logic capacity with substantial embedded memory and a high I/O count to support complex system integration in commercial applications.

Key value comes from its 364,032 logic elements, approximately 15.3 Mbits of embedded memory, and 720 I/O pins, delivered in a 1759-BBGA/1759-FCBGA package with a commercial operating temperature range and RoHS compliance.

Key Features

• Core Logic  Provides 364,032 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Density  720 I/O pins to support broad interface connectivity and parallel bus implementations.
• Power  Operates at a supply voltage range of 950 mV to 1.05 V to match system power-rail requirements.
• Package & Mounting  Surface-mount 1759-BBGA / 1759-FCBGA package; supplier device package listed as 1759-FCBGA (42.5x42.5).
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for environments requiring lead-free components.

Typical Applications

• High-density digital systems  Use the device in designs that require up to 364,032 logic elements to implement large-scale custom logic and control functions.
• Memory-intensive processing  Leverage approximately 15.3 Mbits of embedded memory for data buffering, packet processing, and on-chip storage.
• I/O aggregation and interface bridging  Deploy the FPGA where 720 I/O pins are needed to connect multiple peripherals, high-speed buses, or wide parallel interfaces.
• Commercial electronic products and prototypes  Suitable for commercial-grade systems operating between 0 °C and 85 °C that require a high level of integration and RoHS compliance.

Unique Advantages

• High logic capacity: 364,032 logic elements enable integration of complex algorithms and multiple IP cores on a single device, reducing system-level component count.
• Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM supports local data storage and reduces external memory dependency.
• Extensive I/O flexibility: 720 I/O pins provide the connectivity needed for multi-interface designs and parallel data paths.
• Compact, surface-mount packaging: Available in a 1759-BBGA / 1759-FCBGA form factor (1759-FCBGA (42.5x42.5)) for space-constrained board layouts.
• Commercial temperature rating and RoHS compliance: Designed for commercial applications with an operating range of 0 °C to 85 °C and compliant with RoHS requirements.
• Consistent supply voltage window: Operates within a defined 950 mV to 1.05 V range to align with system power design.

Why Choose XC6VLX365T-2FFG1759C?

The XC6VLX365T-2FFG1759C positions itself as a high-capacity Virtex®-6 LXT FPGA option for commercial designs that demand significant logic resources, on-chip memory, and large I/O counts. Its combination of 364,032 logic elements, approximately 15.3 Mbits of embedded memory, and 720 I/O pins supports consolidation of multiple functions into a single device, simplifying BOM and board complexity.

Engineers and procurement teams targeting commercial applications will find the device suitable for complex digital systems, memory-heavy processing tasks, and interface-rich designs, with RoHS compliance and a clearly defined operating voltage and temperature range to support product development and deployment.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC6VLX365T-2FFG1759C.