XC6VLX365T-2FFG1759I

The XC6VLX365T-2FFG1759I is a Virtex®-6 LXT field programmable gate array from AMD provided in a 1759-FCBGA package. It is an industrial-grade, surface-mount FPGA that combines high logic density, substantial on-chip memory, and a large I/O count for demanding embedded designs.

With 364,032 logic elements, approximately 15.33 Mbits of embedded memory, and up to 720 I/O, this device is suited to applications that require significant programmable logic, wide I/O connectivity, and operation across an industrial temperature range. The device operates from a core supply of 950 mV to 1.05 V and is RoHS compliant.

Key Features

• Core and Density — 364,032 logic elements provide substantial programmable logic capacity for complex digital designs and high-density implementations.
• Embedded Memory — Approximately 15.33 Mbits of on-chip RAM to support data buffering, lookup tables, and memory-intensive processing tasks.
• I/O Resources — Up to 720 I/O pins to support extensive peripheral connectivity, parallel interfaces, and multi-channel systems.
• Power — Core voltage supply range of 950 mV to 1.05 V to match system power rails and design requirements.
• Package & Mounting — 1759-BBGA / 1759-FCBGA package (supplier device package: 1759-FCBGA (42.5x42.5)) in a surface-mount form factor for compact system integration.
• Temperature & Grade — Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded memory for data-path acceleration, parallel processing, and FPGA-based computation.
• Interface aggregation and bridging — Leverage the 720 I/O pins to connect multiple peripherals, implement protocol bridging, or consolidate interface logic on a single device.
• Industrial control systems — Industrial-grade temperature range and rugged package make the device suitable for control, automation, and motor-drive related logic functions.
• Prototyping and system integration — High logic density and on-chip memory enable complex prototype implementations and integration of multiple functions into one FPGA.

Unique Advantages

• High logic capacity: 364,032 logic elements let designers implement large, complex logic hierarchies without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 15.33 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Extensive I/O count: Up to 720 I/O pins simplify system-level connectivity and reduce the need for external multiplexing or expansion logic.
• Industrial temperature rating: -40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, surface-mount package: 1759-FCBGA packaging offers a high-density footprint for space-constrained boards.
• RoHS compliance: Meets lead-free assembly requirements for controlled manufacturing processes.

Why Choose XC6VLX365T-2FFG1759I?

The XC6VLX365T-2FFG1759I positions itself as a high-density, feature-rich FPGA for designs that demand a combination of large programmable logic capacity, significant embedded memory, and broad I/O connectivity within an industrial temperature envelope. Its surface-mount 1759-FCBGA package supports compact board layouts while maintaining the resources needed for complex system functions.

Choose this device for projects that require substantial on-chip resources and reliable operation across -40 °C to 100 °C. It is well suited to engineers developing integrated systems that consolidate multiple functions into a single programmable device and need a device with clear, verifiable hardware characteristics.

Request a quote or submit an inquiry for the XC6VLX365T-2FFG1759I to receive pricing and availability information for your design and procurement needs.