XC6VLX550T-1FFG1759C

The XC6VLX550T-1FFG1759C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC offered in a 1759-FCBGA package. It is supplied as a commercial-grade, surface-mount device with a specified operating temperature range of 0 °C to 85 °C.

This device provides high on-chip logic and memory resources, including 549,888 logic cells and approximately 23.3 Mbits of embedded memory, with up to 840 user I/O and a core voltage supply range of 0.95 V to 1.05 V.

Key Features

• Logic Fabric 549,888 logic cells organized into 42,960 CLBs, delivering substantial programmable logic capacity.
• Embedded Memory Approximately 23.3 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Resources Up to 840 user I/O pins to support wide external interfacing and system connectivity.
• Power Core voltage supply range of 0.95 V to 1.05 V for device operation.
• Package & Mounting 1759-FCBGA package (42.5 × 42.5 mm) / 1759-BBGA case, surface-mount mounting type for high-density PCB integration.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High Logic Capacity: The 549,888 logic cells provide large-scale programmable logic resources for complex designs.
• Substantial On-Chip Memory: Approximately 23.3 Mbits of embedded RAM reduces dependence on external memory for many functions.
• Extensive I/O: 840 I/O pins enable broad interfacing options and flexible system connectivity.
• Compact, High-Density Package: The 1759-FCBGA (42.5 × 42.5 mm) surface-mount package supports dense board layouts while maintaining high resource count.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployment in commercial environments.
• RoHS Compliance: Meets RoHS environmental requirements for regulated substances.

Why Choose XC6VLX550T-1FFG1759C?

The XC6VLX550T-1FFG1759C positions itself as a high-capacity Virtex®-6 LXT FPGA option for designs that require large amounts of programmable logic, significant on-chip RAM, and substantial I/O in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic products.

This device is suited for customers who need scalable, on-chip integration of logic and memory resources and who require a high I/O count in a surface-mount BGA footprint. The combination of logic density, embedded memory, and package density supports complex, space-constrained designs while simplifying BOM and board-level routing.

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