XC6VLX550T-2FF1759C

The XC6VLX550T-2FF1759C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD designed for high-density digital designs. It provides extensive on-chip resources—large logic capacity, substantial embedded memory, and a high I/O count—packaged in a 1759-FCBGA surface-mount package.

This commercial-grade device is suited for designs that require significant logic and memory resources while operating within a 0 °C to 85 °C range and a core supply between 0.95 V and 1.05 V.

Key Features

• Logic Capacity — 549,888 logic elements to support complex digital designs and large combinational/sequential logic implementations.
• Logic Block Count — 42,960 logic cell blocks (CLBs) providing structured resources for mapping user logic.
• Embedded Memory — Approximately 23.3 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage.
• I/O Resources — 840 general-purpose I/O pins to support high pin-count interfacing and parallel connectivity.
• Power Supply — Core voltage supply range from 0.95 V to 1.05 V for compatibility with specified power rails.
• Package & Mounting — 1759-FCBGA (42.5 × 42.5 mm) BGA package, surface mount for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard-temperature applications.
• Compliance — RoHS compliant, meeting common environmental substance requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Large logic capacity and substantial on-chip RAM make this FPGA suitable for compute-intensive processing tasks and complex state machines.
• Data buffering and packet processing — Approximately 23.3 Mbits of embedded memory enable buffering and intermediate storage in networking or streaming designs.
• Multi-I/O systems — With 840 I/O pins, the device supports applications requiring wide parallel interfaces or numerous peripheral connections.
• System integration and prototyping — The combination of extensive logic elements and a high CLB count supports integration of multiple functions into a single FPGA for system prototypes and consolidated designs.

Unique Advantages

• High logic density: 549,888 logic elements reduce the need for multiple devices by consolidating complex designs into a single FPGA.
• Significant embedded memory: Approximately 23.3 Mbits of on-chip RAM minimizes external memory dependency for many buffering and storage tasks.
• Extensive I/O: 840 I/O pins allow direct connection to a broad set of peripherals and high-bandwidth interfaces without additional I/O expanders.
• Board-level packaging: 1759-FCBGA (42.5 × 42.5 mm) surface-mount package supports compact, high-density PCB layouts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Manufacturer backing: Produced by AMD, offering alignment with established FPGA product lines and documentation practices.

Why Choose XC6VLX550T-2FF1759C?

The XC6VLX550T-2FF1759C positions itself as a high-capacity, commercially graded FPGA solution for designs that require large logic resources, substantial embedded memory, and abundant I/O within standard operating temperatures and core voltage ranges. Its 1759-FCBGA package and surface-mount form factor enable compact system integration.

This device is appropriate for engineers and teams building complex digital systems, high-density prototypes, or consolidated multi-function boards where on-chip logic and memory density are primary considerations. Selecting this FPGA supports scalable designs that benefit from centralized logic, embedded RAM, and high pin counts while remaining within commercial temperature and supply constraints.

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