XC6VLX75T-1FFG484C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 5750784 74496 484-BBGA |
|---|---|
| Quantity | 723 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 240 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5820 | Number of Logic Elements/Cells | 74496 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5750784 |
Overview of XC6VLX75T-1FFG484C – Virtex®-6 LXT Field Programmable Gate Array (FPGA) 484-BBGA
The XC6VLX75T-1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 484-ball BGA package optimized for designs requiring substantial programmable logic, embedded memory, and flexible I/O. With tens of thousands of logic elements, multiple megabits of on-chip RAM and a broad I/O complement, it is suited to complex logic implementation and system integration in commercial-grade applications.
Key Features
- Core Logic Contains 74,496 logic elements, providing large-scale programmable logic capacity for complex digital designs.
- Configurable Logic Blocks (CLBs) Implements 5,820 CLBs to structure and distribute logic resources across the device.
- Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
- I/O Resources 240 user I/O pins to support multiple interfaces and peripheral connections.
- Power Core voltage supply range from 0.950 V to 1.05 V to meet device power requirements.
- Package & Mounting 484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Operating Range & Grade Commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
- Compliance RoHS compliant for environmentally responsible manufacturing and assembly.
Typical Applications
- Digital Signal Processing Use the device's large logic capacity and approximately 5.75 Mbits of embedded memory for buffering and compute-heavy signal processing blocks.
- System Prototyping and Validation High logic element count and abundant I/O allow rapid prototyping of complex system architectures and interface validation.
- High-Density I/O Control 240 user I/Os enable control and aggregation of multiple peripherals, sensors, or interface channels in compact designs.
- Custom Logic Acceleration Implement application-specific accelerators that leverage the device's programmable fabric and on-chip memory resources.
Unique Advantages
- High Logic Capacity: 74,496 logic elements provide the resources needed for large-scale combinational and sequential logic functions.
- Substantial On-Chip Memory: Approximately 5.75 Mbits of embedded RAM reduce reliance on external memory for many buffering and LUT requirements.
- Generous I/O Count: 240 I/Os simplify integration with multiple interfaces and external devices without complex multiplexing.
- Compact BGA Package: 484-ball BGA in a 23×23 footprint supports high-density board layouts while maintaining surface-mount compatibility.
- Commercial Grade Flexibility: Rated for 0 °C to 85 °C operation for standard commercial deployments and system-level validation.
- RoHS Compliant: Meets RoHS requirements to support environmentally conscious product designs.
Why Choose XC6VLX75T-1FFG484C?
The XC6VLX75T-1FFG484C combines significant programmable logic capacity, multi-megabit embedded memory, and a broad I/O complement in a compact 484-BBGA surface-mount package. It is positioned for commercial designs that require substantial on-chip resources for custom logic, high-density I/O, and integrated buffering without immediate dependence on external memory.
This FPGA is well suited to engineers and teams developing complex digital systems, prototypes, and accelerators who need a reliable, RoHS-compliant device with clear electrical and thermal operating bounds. Its combination of logic, memory, and packaging supports scalable designs and streamlined board integration.
Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX75T-1FFG484C. Our team can provide technical details and assist with order placement.

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