XC6VLX75T-1FFG484C

IC FPGA 240 I/O 484FBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 5750784 74496 484-BBGA

Quantity 723 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O240Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5820Number of Logic Elements/Cells74496
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5750784

Overview of XC6VLX75T-1FFG484C – Virtex®-6 LXT Field Programmable Gate Array (FPGA) 484-BBGA

The XC6VLX75T-1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 484-ball BGA package optimized for designs requiring substantial programmable logic, embedded memory, and flexible I/O. With tens of thousands of logic elements, multiple megabits of on-chip RAM and a broad I/O complement, it is suited to complex logic implementation and system integration in commercial-grade applications.

Key Features

  • Core Logic Contains 74,496 logic elements, providing large-scale programmable logic capacity for complex digital designs.
  • Configurable Logic Blocks (CLBs) Implements 5,820 CLBs to structure and distribute logic resources across the device.
  • Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
  • I/O Resources 240 user I/O pins to support multiple interfaces and peripheral connections.
  • Power Core voltage supply range from 0.950 V to 1.05 V to meet device power requirements.
  • Package & Mounting 484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
  • Operating Range & Grade Commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
  • Compliance RoHS compliant for environmentally responsible manufacturing and assembly.

Typical Applications

  • Digital Signal Processing Use the device's large logic capacity and approximately 5.75 Mbits of embedded memory for buffering and compute-heavy signal processing blocks.
  • System Prototyping and Validation High logic element count and abundant I/O allow rapid prototyping of complex system architectures and interface validation.
  • High-Density I/O Control 240 user I/Os enable control and aggregation of multiple peripherals, sensors, or interface channels in compact designs.
  • Custom Logic Acceleration Implement application-specific accelerators that leverage the device's programmable fabric and on-chip memory resources.

Unique Advantages

  • High Logic Capacity: 74,496 logic elements provide the resources needed for large-scale combinational and sequential logic functions.
  • Substantial On-Chip Memory: Approximately 5.75 Mbits of embedded RAM reduce reliance on external memory for many buffering and LUT requirements.
  • Generous I/O Count: 240 I/Os simplify integration with multiple interfaces and external devices without complex multiplexing.
  • Compact BGA Package: 484-ball BGA in a 23×23 footprint supports high-density board layouts while maintaining surface-mount compatibility.
  • Commercial Grade Flexibility: Rated for 0 °C to 85 °C operation for standard commercial deployments and system-level validation.
  • RoHS Compliant: Meets RoHS requirements to support environmentally conscious product designs.

Why Choose XC6VLX75T-1FFG484C?

The XC6VLX75T-1FFG484C combines significant programmable logic capacity, multi-megabit embedded memory, and a broad I/O complement in a compact 484-BBGA surface-mount package. It is positioned for commercial designs that require substantial on-chip resources for custom logic, high-density I/O, and integrated buffering without immediate dependence on external memory.

This FPGA is well suited to engineers and teams developing complex digital systems, prototypes, and accelerators who need a reliable, RoHS-compliant device with clear electrical and thermal operating bounds. Its combination of logic, memory, and packaging supports scalable designs and streamlined board integration.

Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX75T-1FFG484C. Our team can provide technical details and assist with order placement.

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