XC6VLX75T-1FFG484I

The XC6VLX75T-1FFG484I is a Virtex-6 LXT Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It provides a sizeable complement of programmable logic, embedded memory and I/O to support complex, configurable digital designs.

Key on-chip resources include 74,496 logic elements, approximately 5.75 Mbits of embedded memory, and up to 240 user I/O pins. The device is offered for industrial-grade applications with a specified operating range and RoHS compliance.

Key Features

• Core Logic 74,496 logic elements provide significant capacity for implementing custom digital functions and state machines.
• Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• I/O Up to 240 I/O pins to interface with external peripherals, sensors, and high-speed buses.
• Power Supply Supported core voltage range from 0.95 V to 1.05 V for the FPGA core supply.
• Package and Mounting 484-ball BGA package (484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade Industrial operating temperature range of −40 °C to 100 °C, suitable for harsher environments.
• Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Digital signal processing — Use the device's logic capacity and embedded memory to implement filtering, data path pipelines, and custom DSP blocks.
• High-density logic integration — Deploy complex state machines and control logic using the available 74,496 logic elements.
• I/O-heavy system interfaces — Leverage up to 240 I/O pins to bridge multiple peripherals, sensors, and external memory interfaces.
• Industrial control and automation — Industrial temperature rating and surface-mount BGA packaging support deployment in ruggedized control systems.

Unique Advantages

• High logic density: 74,496 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM supports local buffering and memory-intensive processing without external memory.
• Flexible I/O count: Up to 240 user I/O pins allow direct interfacing with a wide range of peripherals and subsystems.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet temperature demands of industrial applications.
• Compact BGA footprint: 484-ball BGA (23×23) enables a space-efficient board layout while maintaining high connectivity.
• Regulatory compliance: RoHS compliance simplifies environmental conformity for product builds.

Why Choose XC6VLX75T-1FFG484I?

The XC6VLX75T-1FFG484I combines a large pool of programmable logic, meaningful on-chip memory, and a high I/O count in a compact 484-ball BGA footprint, making it suitable for designs that require integration of complex digital functions within industrial temperature ranges. Its documented electrical and packaging specifications enable predictable integration into production hardware.

This device is a fit for engineering teams targeting scalable, high-capacity FPGA implementations where on-chip resources and industrial-grade thermal performance are key selection criteria. Manufacturer documentation is available for detailed integration and electrical guidance.

Request a quote or submit a purchase inquiry today to obtain pricing and availability for the XC6VLX75T-1FFG484I.