XC6VLX75T-1FF784C

The XC6VLX75T-1FF784C is a Virtex®-6 LXT field programmable gate array (FPGA) offered in a 784-FCBGA (29×29) package. It delivers a high count of programmable logic resources, embedded memory, and a large number of I/O pins for designs that require dense logic integration and extensive external interfacing.

Typical uses include compact, I/O-rich digital systems where on-chip RAM, abundant logic elements, and configurable I/O enable custom hardware acceleration, signal processing, and complex control functions within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 74,496 logic elements provided for implementing complex digital logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage for real-time processing.
• I/O Density  360 user I/Os to support wide parallel interfaces, multiple peripherals, and extensive external connectivity.
• Package  784‑BBGA / 784‑FCBGA (29×29) surface-mount package for compact board-level integration where high pin count and tight footprint are required.
• Power Supply  Core voltage support from 950 mV to 1.05 V to match system power rails and FPGA core requirements.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C suitable for general-purpose electronic products.
• RoHS Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Signal Processing: Use the large logic array and on-chip RAM for buffering and implementing real-time filtering, transform engines, or custom datapaths.
• Communications and Networking: High I/O count enables wide parallel interfaces and multi-channel connectivity for packet processing or protocol bridging.
• Prototyping and Custom Hardware Acceleration: Dense logic resources and embedded memory support hardware acceleration blocks and system prototyping on a single FPGA.
• Test & Measurement: Combine configurable logic and many I/Os for precision control, data capture, and instrument front-end interfacing.

Unique Advantages

• High Logic Density: Approximately 74,496 logic elements allow implementation of substantial digital functions without external programmable logic.
• Significant On‑Chip Memory: Approximately 5.75 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs.
• Extensive I/O Resources: 360 I/Os simplify integration with multiple peripherals, sensors, and parallel interfaces, decreasing board-level bridging complexity.
• Compact Ball Grid Package: The 784-FCBGA (29×29) package offers a high-pin-count solution in a defined footprint for space-constrained designs.
• Commercial Temperature Range: Rated 0 °C to 85 °C for a wide range of general-purpose electronic applications.
• Regulatory Compliance: RoHS-compliant to support modern manufacturing requirements and assembly processes.

Why Choose XC6VLX75T-1FF784C?

The XC6VLX75T-1FF784C positions itself as a high-capacity, I/O-rich Virtex‑6 LXT FPGA option for designers needing on-chip memory and substantial programmable logic within a 784‑ball FCBGA footprint. Its combination of approximately 74,496 logic elements, roughly 5.75 Mbits of embedded RAM, and 360 I/Os makes it well suited for demanding digital processing, interfacing, and prototyping tasks in commercial electronic products.

Choose this FPGA when your design requires a balance of dense logic resources, plentiful I/O, and on-chip memory in a compact surface-mount package, all within standard commercial operating conditions.

Request a quote or submit an inquiry for pricing and availability of the XC6VLX75T-1FF784C to get started with your design integration and procurement planning.