XC6VLX550T-2FFG1759C

The XC6VLX550T-2FFG1759C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1759-ball FCBGA package designed for complex digital designs that require substantial logic capacity, embedded memory and high I/O density. Its architecture delivers a large number of configurable logic resources and on-chip RAM suitable for demanding processing, control and interfacing tasks within commercial-temperature applications.

Key Features

• Logic Capacity — Provides 42,960 configurable logic blocks (CLBs) delivering 549,888 logic elements for large FPGA designs and partitioned logic implementation.
• Embedded Memory — Includes approximately 23.3 Mbits of on-chip RAM (23,298,048 bits) to support buffering, data processing and state storage without external memory for many functions.
• I/O Density — Up to 840 user I/O pins to accommodate high-pin-count interfaces and multiple parallel connections.
• Package & Mounting — Supplied in a 1759-FCBGA package (42.5 × 42.5 mm) with surface-mount mounting for board-level integration.
• Power Supply — Core voltage range of 0.95 V to 1.05 V, enabling predictable power domain planning in system designs.
• Temperature & Grade — Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant, supporting lead-free manufacturing processes where required.

Typical Applications

• High-density digital systems — Suitable for designs that require extensive combinational and sequential logic along with many I/O channels.
• Memory-intensive processing — On-chip RAM capacity supports buffering, packet processing and intermediate data storage without immediate reliance on external memory.
• Board-level integration — Surface-mount FCBGA package and high I/O count enable compact, integrable solutions for commercial electronic products.

Unique Advantages

• Substantial logic resources: 549,888 logic elements enable complex logic implementations and large-scale designs.
• Significant embedded memory: Approximately 23.3 Mbits of on-chip RAM reduces dependence on external memory for many use cases.
• High I/O capacity: 840 I/Os provide flexibility for parallel interfaces and multiple peripheral connections.
• Compact package footprint: 1759-FCBGA (42.5 × 42.5 mm) surface-mount package supports dense board layouts and standard assembly processes.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to meet standard commercial deployments.
• RoHS compliant: Facilitates lead-free manufacturing and regulatory alignment for many markets.

Why Choose XC6VLX550T-2FFG1759C?

The XC6VLX550T-2FFG1759C positions itself as a high-capacity, commercially rated FPGA option for system designers who need a combination of large logic resources, substantial on-chip memory and extensive I/O in a single, surface-mount package. Its specifications make it well suited for complex digital processing, data buffering and high-density interfacing in commercial products.

For development teams and procurement professionals targeting scalable FPGA implementations with verifiable on-chip resources and a standard commercial temperature range, this Virtex®-6 LXT device delivers measurable capacity and integration that align with mid- to large-scale design requirements.

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