XC6VLX550T-1FF1759I

The XC6VLX550T-1FF1759I is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1759-ball FCBGA package. It delivers very large logic capacity and substantial on-chip RAM to support complex, memory‑rich implementations.

With 549,888 logic elements, approximately 23.3 Mbits of embedded memory and 840 I/O, this device is targeted at designs that require high integration, extensive I/O connectivity and industrial temperature operation.

Key Features

• Logic Capacity  42,960 configurable CLBs supporting 549,888 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 23.3 Mbits of on‑chip RAM to support buffering, state storage and memory‑intensive functions without external RAM.
• I/O  840 user I/O pins to enable dense connectivity to peripherals, sensors, memory and high‑pin-count interfaces.
• Power Supply  Core voltage supply range from 950 mV to 1.05 V for defined core power requirements.
• Package & Mounting  1759‑FCBGA (42.5 × 42.5 mm) package in a surface mount format for high‑density board integration.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in a wide range of environmental conditions.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High‑density logic systems  Large programmable logic capacity and abundant CLBs make the device suitable for complex logic consolidation and custom accelerators.
• Memory‑intensive processing  Approximately 23.3 Mbits of embedded RAM supports buffering, packet processing and real‑time data handling without immediate external memory dependence.
• High‑I/O interface hubs  840 I/O pins enable aggregation and protocol bridging between multiple peripherals, sensors and subsystems.

Unique Advantages

• Extensive programmable resources: 42,960 CLBs and 549,888 logic elements provide the headroom to implement complex algorithms and custom datapaths on a single device.
• Substantial on‑chip memory: Approximately 23.3 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and lowering BOM cost.
• High I/O density: 840 I/O pins enable broad peripheral connectivity and support for multi‑lane interfaces or large sensor arrays.
• Industrial temperature rating: Specified −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact high‑density package: 1759‑FCBGA (42.5 × 42.5 mm) surface mount package allows integration into densely populated PCBs.
• Regulatory readiness: RoHS compliance supports environmentally conscious product designs.

Why Choose XC6VLX550T-1FF1759I?

The XC6VLX550T-1FF1759I positions itself as a high‑capacity, memory‑rich Virtex®‑6 LXT FPGA suitable for designs that require substantial programmable logic, generous embedded RAM and high I/O counts. Its industrial temperature rating and surface‑mount FCBGA package make it appropriate for robust, board‑level integration where longevity and environmental tolerance are important.

Engineers seeking a solution for consolidating complex logic, implementing memory‑intensive functions or providing dense I/O connectivity will find the device’s combination of logic elements, embedded memory and package density advantageous for scalable, long‑term designs backed by AMD manufacturing.

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