XC6VLX550T-1FFG1759I

The XC6VLX550T-1FFG1759I is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 1759-FCBGA package. It targets designs that require very large logic capacity, substantial on-chip RAM, and a high count of general-purpose I/O.

This device is offered in an industrial-grade temperature range and supports a core supply window of 950 mV to 1.05 V, enabling use in systems that must operate across a wide thermal range while maintaining dense digital integration.

Key Features

• Core Architecture  Virtex®-6 LXT FPGA architecture provided in the XC6VLX550T-1FFG1759I part.
• Logic Resources  549,888 logic elements to implement large, complex digital designs.
• Embedded Memory  Approximately 23.3 Mbits of on-chip RAM for buffering, FIFO structures, and memory-intensive algorithms.
• I/O and Package  Up to 840 I/O pins delivered from a 1759-FCBGA (42.5×42.5 mm) package, optimized for high-pin-count system interfaces and board-level routing.
• Power Supply  Core voltage support from 950 mV to 1.05 V to match system power delivery requirements.
• Temperature and Grade  Industrial-grade device specified for operation from -40°C to 100°C.
• Mounting and Compliance  Surface-mount FCBGA package construction; RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the device where wide operating temperatures and large logic resources are required for control, sequencing, and system orchestration.
• High-Density Digital Processing  Implement complex logic networks and algorithm acceleration that benefit from nearly 550k logic elements and significant embedded RAM.
• I/O-Intensive Systems  Support multi-channel interfaces, parallel buses, and aggregated signal processing with up to 840 I/O pins.
• Data Acquisition and Signal Conditioning  Leverage on-chip memory and logic resources for real-time data buffering and preprocessing in measurement and acquisition systems.

Unique Advantages

• Very High Logic Capacity: 549,888 logic elements enable large-scale integration of digital functions on a single device, reducing the need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 23.3 Mbits of embedded RAM provide local storage for buffering and intermediate data processing, simplifying system memory architecture.
• Extensive I/O Count: 840 I/O pins in a single FCBGA package support dense external interfacing and reduce board-level component count.
• Industrial Temperature Range: Rated from -40°C to 100°C for deployment in temperature-challenging environments.
• Compact, High-Pin-Count Package: The 1759-FCBGA (42.5×42.5 mm) package delivers high pin density in a surface-mount form factor for space-constrained boards.
• RoHS Compliant: Meets RoHS requirements for environmental compliance in assembly and production.

Why Choose XC6VLX550T-1FFG1759I?

The XC6VLX550T-1FFG1759I positions itself for designs that demand very high logic density, significant embedded memory, and a large number of I/O connections within a packaged industrial-grade FPGA. Its combination of nearly 550k logic elements, approximately 23.3 Mbits of on-chip RAM, and 840 I/O pins makes it suitable for consolidated digital systems that prioritize integration and board-level simplicity.

This part is appropriate for engineers and procurement teams specifying FPGAs for industrial applications where operating temperature range, package density, and verified electrical supply windows are important selection criteria.

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