XC6VLX75T-1FF484I

The XC6VLX75T-1FF484I is a Virtex-6 LXT Field Programmable Gate Array in a 484-ball FCBGA (23 × 23) surface-mount package. It provides a combination of high logic capacity, embedded memory, and extensive I/O for complex digital system designs.

Key silicon characteristics include 74,496 logic elements, approximately 5.75 Mbits of on-chip RAM, and 240 I/O pins. The device operates from 0.95 V to 1.05 V and is specified for an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Logic Capacity  74,496 logic elements suitable for large, complex digital designs and high-density implementation.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM to support buffering, data processing, and memory-intensive algorithms.
• I/O Resources  240 general-purpose I/O pins to support multi-channel interfaces and parallel connectivity requirements.
• Package and Mounting  484-BBGA (484-FCBGA, 23 × 23) surface-mount package for compact board-level integration.
• Power and Voltage  Core supply range of 0.95 V to 1.05 V to match system power rails and voltage planning.
• Operating Temperature  Industrial-grade specification from −40 °C to 100 °C for deployment in temperature-variable environments.
• Compliance  RoHS compliant status for environmental and regulatory considerations.

Typical Applications

• High-density digital processing  Implement custom datapaths and protocol engines that require significant logic capacity and on-chip memory.
• Memory-centric algorithms  Use the embedded RAM for buffering, filtering, and temporary storage within real-time processing flows.
• I/O-intensive interface functions  Leverage 240 I/O pins to implement parallel interfaces, bridging, or multi-channel signal routing.
• Industrial control systems  Deploy in industrial environments that require operation across −40 °C to 100 °C and RoHS compliance.

Unique Advantages

• High logic density: 74,496 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system BOM.
• Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM supports local buffering and algorithm acceleration without external memory.
• Extensive I/O count: 240 I/O pins enable broad connectivity options for complex, multi-interface designs.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for reliable performance in temperature-variable installations.
• Compact FCBGA package: 484-ball, 23 × 23 FCBGA footprint helps optimize board area while maintaining high pin count.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6VLX75T-1FF484I?

The XC6VLX75T-1FF484I positions itself as a high-capacity Virtex-6 LXT FPGA that balances logic density, embedded memory, and I/O resources within a compact 484-FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require robustness and regulatory alignment.

This device is well suited for engineers building complex digital systems that need significant on-chip resources and flexible interfacing. The availability of technical documentation from the manufacturer supports design integration and long-term deployment considerations.

Request a quote or submit an inquiry for pricing and availability to begin specifying the XC6VLX75T-1FF484I into your next design project.