XC6VLX75T-1FFG784C

IC FPGA 360 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 360 5750784 74496 784-BBGA, FCBGA

Quantity 950 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case784-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5820Number of Logic Elements/Cells74496
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5750784

Overview of XC6VLX75T-1FFG784C – Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC, 360 I/O, 784-FCBGA

The XC6VLX75T-1FFG784C is a Virtex®-6 LXT FPGA IC from AMD, delivering high logic and embedded memory capacity in a compact field‑programmable package. It combines 74,496 logic elements with approximately 5.75 Mbits of on‑chip RAM and 360 user I/O in a 784‑ball FCBGA (29×29) surface‑mount package.

This commercial‑grade device operates from a core supply range of 0.95 V to 1.05 V and across an operating temperature range of 0 °C to 85 °C, and is RoHS compliant for regulated environments.

Key Features

  • Core Logic Density 74,496 logic elements for implementing complex digital functions and highly parallel logic structures.
  • Embedded Memory Approximately 5.75 Mbits of on‑chip RAM to support buffering, implementation of state machines, and local data storage.
  • I/O Capacity 360 user I/O pins to support wide external interfacing and connectivity requirements.
  • Package 784‑BBGA, FCBGA (784‑FCBGA, 29×29) surface‑mount package for high‑pin‑count designs in a compact footprint.
  • Power Core voltage supply range of 0.95 V to 1.05 V to integrate with regulated power domains.
  • Operating Range Commercial operating temperature from 0 °C to 85 °C and commercial grade classification.
  • Environmental RoHS compliant.

Unique Advantages

  • High logic capacity: 74,496 logic elements enable large, complex designs and substantial parallelism without external logic.
  • Substantial on‑chip memory: Approximately 5.75 Mbits of embedded RAM reduces dependency on external memory for many buffering and data‑path needs.
  • Extensive I/O connectivity: 360 I/O pins support broad peripheral and interface integration directly on the FPGA.
  • Compact, high‑pin package: 784‑ball FCBGA (29×29) delivers high pin count in a surface‑mount form factor for dense PCB layouts.
  • Controlled supply requirements: Narrow core voltage range (0.95–1.05 V) simplifies power budgeting and regulator selection for the core domain.
  • Compliance and commercial readiness: RoHS compliance and a defined 0 °C to 85 °C operating range support standard commercial product deployments.

Why Choose XC6VLX75T-1FFG784C?

The XC6VLX75T-1FFG784C positions itself as a high‑capacity Virtex®‑6 LXT FPGA option for designs that require a large number of logic elements, significant on‑chip memory, and extensive I/O in a single, surface‑mount package. Its combination of logic density, embedded RAM, and a 360‑pin I/O interface makes it suitable for complex, memory‑rich digital implementations where board space and integration matter.

Backed by AMD documentation and support, this commercial‑grade, RoHS‑compliant FPGA offers a clear specification set—logic elements, RAM bits, I/O count, package, power, and temperature—that helps simplify component selection and reliability planning for development and production cycles.

Request a quote or submit an inquiry today to receive pricing and availability for the XC6VLX75T-1FFG784C.

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