XC6VLX75T-1FFG784I

The XC6VLX75T-1FFG784I is a Virtex®-6 LXT field-programmable gate array (FPGA) IC from AMD designed for demanding programmable logic applications. With 74,496 logic elements, approximately 5.75 Mbits of embedded memory, and 360 user I/Os, this device targets designs that require high logic capacity, substantial on-chip memory, and dense I/O connectivity.

Packaged in a 784-ball FCBGA (29 × 29) and rated for industrial operation, the device supports surface-mount integration and is suited to projects that need robust thermal and environmental margins within the specified operating range.

Key Features

• Core Capacity 74,496 logic elements provide substantial programmable logic resources for implementing complex custom logic and pipelined datapaths.
• Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory for many use cases.
• I/O Density 360 user I/Os offer high connectivity for parallel interfaces, high-speed peripherals, and multi-channel I/O requirements.
• Power Supply Core voltage supply range of 0.95 V to 1.05 V to match system power domains and enable predictable power provisioning.
• Package and Mounting 784-ball FCBGA package (784-BBGA, supplier package 784-FCBGA 29×29) designed for surface-mount assembly in space-constrained PCBs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Automation — Use the device for motor control, programmable logic controllers, and real-time processing where industrial temperature range and high I/O counts are required.
• Data Acquisition & Processing — Implement front-end signal aggregation and preprocessing using the on-chip RAM and abundant logic resources to reduce external memory dependence.
• Communications and Networking — Deploy for protocol bridging, packet processing, and custom interface implementations that demand large logic fabrics and numerous I/Os.
• Test & Measurement Equipment — Leverage high logic capacity and I/O density for instrument control, data aggregation, and custom FPGA-based processing blocks.

Unique Advantages

• High Logic Integration: 74,496 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity and BOM count.
• Significant On-Chip Memory: Approximately 5.75 Mbits of embedded RAM enable local buffering and algorithm acceleration without immediate need for external memory.
• Extensive I/O Capability: 360 user I/Os support multi-channel interfaces and dense peripheral connectivity for flexible system designs.
• Industrial Reliability: Specified −40 °C to 100 °C operating range and industrial grade classification for deployment in temperature-challenging environments.
• Compact Board Integration: 784-ball FCBGA (29×29) package and surface-mount mounting simplify PCB layout for space-constrained systems.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and product compliance goals.

Why Choose XC6VLX75T-1FFG784I?

The XC6VLX75T-1FFG784I positions itself as a high-capacity, industrial-grade Virtex®-6 LXT FPGA suitable for engineers needing a combination of large programmable logic fabric, substantial embedded memory, and high I/O density. Its package and supply voltage characteristics make it a practical choice for compact, power-conscious designs that must operate across a wide temperature range.

This device is aimed at teams building complex, scalable designs—such as industrial controllers, communication systems, and data acquisition platforms—that benefit from on-chip resources and a robust physical package backed by AMD's Virtex-6 LXT family lineage.

Request a quote or contact sales to discuss availability, pricing, and how the XC6VLX75T-1FFG784I can fit into your next design.