XC6VLX75T-2FF484C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 5750784 74496 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,116 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 240 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5820 | Number of Logic Elements/Cells | 74496 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5750784 |
Overview of XC6VLX75T-2FF484C – Virtex®-6 LXT FPGA, 484-FCBGA (23×23)
The XC6VLX75T-2FF484C is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD. It provides 74,496 logic elements, approximately 5.75 Mbits of embedded memory, and 240 user I/O pins for complex digital designs.
Packaged in a 484-BBGA FCBGA (supplier device package: 484-FCBGA, 23×23) surface-mount package, this commercial-grade device operates from a core voltage supply of 950 mV to 1.05 V and across an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Logic Capacity 74,496 logic elements for implementing large-scale digital logic and custom compute blocks.
- Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support buffering, state storage, and data-path requirements.
- I/O Resources 240 user I/O pins to accommodate multiple interfaces and parallel connections.
- Power and Voltage Core voltage supply range of 950 mV to 1.05 V to match system power architectures.
- Package and Mounting 484-BBGA FCBGA package (484-FCBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Temperature Rating Commercial-grade operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 74,496 logic elements enable implementation of complex logic and parallel processing functions without external logic expansion.
- Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
- Flexible interfacing: 240 I/O pins provide room for multiple peripheral connections and high-bandwidth interfaces.
- Compact FCBGA package: 484-FCBGA (23×23) surface-mount package helps conserve PCB area while supporting high pin count.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
- RoHS compliant: Meets common environmental requirements for electronic assemblies.
Why Choose XC6VLX75T-2FF484C?
The XC6VLX75T-2FF484C delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 484-FCBGA package, making it suitable for commercial designs that require significant on-chip integration. Its specified core voltage range and operating temperature provide clear electrical and environmental parameters for system-level planning.
This device is appropriate for design teams and procurement sourcing looking for a Virtex-6 LXT-class FPGA with defined logic, memory, and I/O characteristics and RoHS compliance for streamlined assembly and regulatory alignment.
Request a quote or submit an inquiry to get availability and pricing information for the XC6VLX75T-2FF484C.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
