XC6VLX75T-2FFG784C

The XC6VLX75T-2FFG784C is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, offered in a 784-ball FCBGA package. It provides a high-logic-density programmable fabric with on-chip memory and extensive I/O for commercial-grade designs.

With 74,496 logic elements, approximately 5.75 Mbits of embedded memory and 360 user I/Os, this device is suited to commercial applications that require configurable digital logic, substantial embedded RAM, and a compact surface-mount package.

Key Features

• Core Logic  74,496 logic elements provide substantial programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM to support buffering, lookup tables, and temporary data storage within the FPGA fabric.
• I/O Resources  360 user I/Os to interface with peripherals and external devices while maintaining system integration in a single device.
• Power  Supported supply range from 950 mV to 1.05 V for core power, enabling operation within specified supply margins.
• Package & Mounting  784-FCBGA (29×29) package, listed as 784-BBGA, FCBGA package case, designed for surface-mount assembly.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Programmable system prototyping  Use the device’s 74,496 logic elements and embedded RAM to implement and validate complex digital designs.
• I/O-rich control and interface  Leverage 360 user I/Os to integrate multiple peripheral interfaces or custom I/O configurations in a compact package.
• Embedded memory–centric functions  Approximately 5.75 Mbits of on-chip RAM supports buffering, packet handling, and intermediate data storage within the FPGA.

Unique Advantages

• High logic density: 74,496 logic elements enable implementation of sizable digital systems without external logic expansion.
• Significant on-chip memory: Approximately 5.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 360 I/Os simplify board-level integration by providing ample signals for peripherals and interfaces.
• Compact surface-mount package: 784-FCBGA (29×29) format allows high-density PCB layouts while supporting surface-mount assembly processes.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS compliant: Conforms to RoHS requirements for regulatory and environmental considerations.

Why Choose XC6VLX75T-2FFG784C?

The XC6VLX75T-2FFG784C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a commercial-grade Virtex®-6 LXT FPGA. Its supply and thermal specifications, combined with a compact 784-FCBGA package, make it suitable for engineers seeking a programmable solution that integrates substantial functionality on-chip.

This part is appropriate for design teams needing scalable programmable logic, sizeable internal memory resources, and flexible I/O in a surface-mount package, while meeting RoHS compliance for commercial product development.

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