XC6VLX75T-2FFG784I

The XC6VLX75T-2FFG784I is a Virtex®-6 LXT field-programmable gate array (FPGA) IC manufactured by AMD. It provides high logic density with 74,496 logic elements and approximately 5.75 Mbits of on-chip RAM, making it suitable for complex, resource-intensive FPGA designs.

Packaged in a 784-ball FCBGA (29 × 29 mm) surface-mount package, the device supports 360 user I/Os and operates over an industrial temperature range of −40 °C to 100 °C with a core supply range of 0.95 V to 1.05 V.

Key Features

• Logic Capacity — 74,496 logic elements provide the programmable fabric needed for complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 5.75 Mbits of on-chip RAM to support data buffering, state machines, and memory-intensive functions.
• I/O Density — 360 user I/O pins to enable connections to peripherals, memory interfaces, and board-level signals.
• Package & Mounting — 784-ball BGA FCBGA package in a 29 × 29 mm footprint; surface-mount mounting type for standard PCB assembly.
• Power — Core voltage supply range of 0.95 V to 1.05 V for integration with system power rails and core regulators.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS-compliant.

Unique Advantages

• High logic density: 74,496 logic elements support complex logic partitions and large-scale custom functions without immediate need for external logic.
• Significant on-chip memory: Approximately 5.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage tasks.
• Broad I/O availability: 360 user I/Os allow flexible interfacing to multiple peripherals and high-pin-count board designs.
• Industrial temperature range: Rated for −40 °C to 100 °C to meet demanding environmental requirements.
• Compact BGA footprint: 784-FCBGA (29 × 29 mm) package offers a balance of pin count and board space for high-density system designs.
• Manufacturer pedigree: Supplied by AMD and provided in a standardized FCBGA package for established assembly and supply-chain processes.

Why Choose XC6VLX75T-2FFG784I?

The XC6VLX75T-2FFG784I positions itself as a high-density, industrial-grade Virtex®-6 LXT FPGA option for designs that demand substantial programmable logic, embedded memory, and a large number of I/Os in a compact BGA package. Its combination of 74,496 logic elements, approximately 5.75 Mbits of on-chip RAM, and 360 I/Os makes it well suited to applications requiring integration of complex digital functions and substantial local memory.

With a core supply range of 0.95 V to 1.05 V, surface-mount 784-FCBGA packaging, and operation across −40 °C to 100 °C, this device is targeted at engineered systems requiring durable, high-capacity FPGA resources from a recognized manufacturer.

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