XC6VLX75T-3FFG784C

The XC6VLX75T-3FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, provided in a 784-ball FCBGA package. This commercial-grade FPGA delivers a high logic element count paired with several megabits of on-chip RAM and a large I/O complement for designs that require substantial programmable logic and dense interfacing.

Key Features

• Core Logic Approximately 74,496 logic elements provide substantial capacity for custom digital logic and aggregation of multiple functions on a single device.
• Configurable Logic Blocks 5,820 configurable logic block units (as specified) to organize and distribute logic resources across the device.
• Embedded Memory Approximately 5.75 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Density 360 user I/O pins to support high-density external interfacing and multiple parallel connections.
• Power Supply Core voltage supply range of 0.95 V to 1.05 V to match standard low-voltage FPGA power domains.
• Package and Mounting 784-ball FCBGA package (784-FCBGA, 29×29 mm) designed for surface-mount assembly to support compact board layouts.
• Operating Range Commercial operating temperature range from 0 °C to 85 °C for typical commercial-environment deployments.
• Environmental Compliance RoHS compliant to meet regulatory requirements for lead-free assemblies.

Typical Applications

• Protocol Conversion and Interface Bridging Use the 360 I/Os and abundant logic elements to implement parallel and serial interface aggregation, translation, and bridging functions.
• Custom Digital Acceleration Deploy approximately 74,496 logic elements and 5.75 Mbits of embedded memory for offloading and accelerating domain-specific digital workloads.
• System Prototyping and Integration Leverage the device’s capacity and package density for prototyping multi-function systems or consolidating multiple discrete functions into a single FPGA.

Unique Advantages

• High logic capacity: Approximately 74,496 logic elements allow consolidation of complex designs and multiple functions on a single FPGA.
• Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM provides local buffering and state storage, reducing external memory requirements.
• Large I/O complement: 360 I/O pins support dense interfacing to peripherals, sensors, and high-pin-count connectors.
• Compact surface-mount package: 784-FCBGA (29×29 mm) enables high-density PCB integration while maintaining robust soldered connections.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match standard commercial applications.
• Regulatory readiness: RoHS compliance simplifies adoption into lead-free manufacturing flows.

Why Choose XC6VLX75T-3FFG784C?

The XC6VLX75T-3FFG784C combines a large pool of logic elements, several megabits of embedded RAM, and a high I/O count in a compact 784-ball FCBGA package, making it suitable for commercial designs that require extensive programmable logic and dense external connectivity. Its 0.95–1.05 V core supply and commercial operating temperature range align it with typical commercial system requirements, while RoHS compliance supports lead-free production.

This device is a practical option for engineers seeking to integrate substantial custom logic and memory resources into a single FPGA footprint, enabling consolidation, faster iteration, and flexible system architectures within commercial temperature environments.

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