XC6VSX315T-1FF1156I

The XC6VSX315T-1FF1156I is a Virtex®-6 SXT Field Programmable Gate Array (FPGA) from AMD designed for industrial applications that require high logic density and extensive I/O. It combines a large number of logic elements with substantial embedded memory and a broad I/O complement to support complex, high-channel-count designs.

Key device attributes include 314,880 logic elements, approximately 25.95 Mbits of on-chip RAM, up to 600 I/O pins, and an industrial operating range, packaged in a 1156-FCBGA (35x35) surface-mount format.

Key Features

• Core Logic 314,880 logic elements provide substantial programmable fabric for implementing complex digital functions and custom logic blocks.
• Embedded Memory Approximately 25.95 Mbits of on-chip RAM to support large buffering, state storage, and local data processing.
• I/O Capacity Up to 600 general-purpose I/O pins to enable high-channel-count interfacing and extensive peripheral connectivity.
• Power Supply Core voltage requirement of 950 mV to 1.05 V for the device core.
• Package and Mounting 1156-FCBGA (35x35) package in a surface-mount form factor suitable for board-level integration.
• Operating Range Industrial-grade device rated for operation from -40 °C to 100 °C.
• Regulatory Compliance RoHS-compliant for environmentally conscious designs.

Typical Applications

• Industrial Automation Control and sensor interfacing where industrial temperature range and large I/O counts are required.
• High-Density Signal Processing On-chip memory and extensive logic resources support buffering and custom processing pipelines.
• Communications and Networking Large logic capacity and many I/O enable aggregation, protocol handling, and data plane customization.

Unique Advantages

• High Logic Density: 314,880 logic elements give designers room to implement complex, integrated functions without partitioning across multiple devices.
• Significant On-Chip RAM: Approximately 25.95 Mbits of embedded memory reduces dependence on external memory for many buffering and stateful tasks.
• Large I/O Count: Up to 600 I/O pins simplify system-level interfacing and reduce the need for external multiplexing.
• Industrial Temperature Rating: Qualified for operation from -40 °C to 100 °C, making the device suitable for harsh or temperature-variable environments.
• Surface-Mount FCBGA Package: 1156-FCBGA (35x35) package supports compact board layouts and automated assembly processes.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose XC6VSX315T-1FF1156I?

The XC6VSX315T-1FF1156I positions itself as a high-capacity, industrial-grade FPGA suited to designs that demand a combination of large programmable logic, substantial embedded memory, and broad I/O. Its FCBGA packaging and surface-mount format support compact, production-ready board implementations.

This device is appropriate for engineering teams building industrial control systems, high-channel communications equipment, or complex signal-processing applications that require long-term robustness and a strong balance of integration and I/O capability.

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