XC6VSX315T-1FFG1759C

The XC6VSX315T-1FFG1759C is a Virtex-6 SXT field programmable gate array (FPGA) from AMD. It delivers a large logic fabric and substantial on-chip memory in a high-pin-count FCBGA package for designs that require dense logic, extensive embedded RAM, and large I/O connectivity.

With 314,880 logic elements, approximately 25.95 Mbits of embedded RAM, and up to 720 I/O pins, this commercial-grade FPGA targets applications that need significant integration and I/O bandwidth while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  314,880 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory  Approximately 25.95 Mbits of on-chip RAM supports buffering, data storage, and inline processing without external memory.
• I/O Density  Up to 720 I/O pins accommodate high-channel-count interfaces and dense board-level interconnects.
• Package & Mounting  1759-FCBGA (42.5 × 42.5 mm) ball-grid array package with surface-mount mounting for compact, high-density PCB integration.
• Power Supply  Core voltage operating range from 0.95 V to 1.05 V for designs that target this supply window.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for regulatory alignment in lead-free product assemblies.

Typical Applications

• High-density logic systems  Designs that require a large number of programmable logic resources can utilize the 314,880 logic elements for complex state machines and deep data-paths.
• On-chip buffering and processing  Systems needing significant embedded memory can leverage approximately 25.95 Mbits of RAM for packet buffering, frame storage, or intermediate data processing.
• High I/O-count designs  Applications requiring numerous external connections can take advantage of up to 720 I/O pins for parallel interfaces, multi-lane links, or sensor arrays.

Unique Advantages

• High logic capacity: 314,880 logic elements enable integration of complex functions on a single device, reducing the need for multiple FPGAs.
• Large embedded memory: Approximately 25.95 Mbits of on-chip RAM simplifies designs by minimizing external memory dependence for many buffering and storage tasks.
• Extensive I/O connectivity: Up to 720 I/O pins support high-channel-count systems and flexible board-level partitioning.
• Compact, high-density packaging: The 1759-FCBGA (42.5 × 42.5 mm) package provides a balance of pin count and PCB real estate for demanding applications.
• Commercial operating range: Rated for 0 °C to 85 °C operation and RoHS compliance, fitting many standard commercial product deployments.
• Defined supply window: Operates within a core voltage range of 0.95 V to 1.05 V to match power-rail design targets.

Why Choose XC6VSX315T-1FFG1759C?

The XC6VSX315T-1FFG1759C positions itself as a high-capacity Virtex-6 SXT FPGA option for teams that need substantial programmable logic, large on-chip memory, and high I/O density in a single commercial-grade device. Its combination of 314,880 logic elements, approximately 25.95 Mbits of embedded RAM, and up to 720 I/O pins enables consolidation of complex functions and high-channel connectivity on one FPGA.

This device is well suited for development projects and production designs that require long-term availability from a recognized FPGA family, scalable logic resources, and a clear set of electrical and thermal operating limits to support board-level integration and system planning.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC6VSX315T-1FFG1759C.