XC6VSX315T-2FF1759C

The XC6VSX315T-2FF1759C is a Virtex®-6 SXT Field Programmable Gate Array from AMD, designed for applications requiring substantial programmable logic, on-chip memory, and high I/O counts. Its combination of 314,880 logic elements, approximately 25.95 Mbits of embedded RAM, and up to 720 I/O pins addresses designs that need dense logic integration and extensive external connectivity.

This device is offered in a 1759-FCBGA package (42.5 × 42.5 mm) for surface-mount assembly and is specified for commercial-grade operation with a supply voltage range of 950 mV to 1.05 V and an operating temperature range of 0°C to 85°C.

Key Features

• Core Architecture Virtex-6 SXT FPGA family device providing a large programmable logic resource for complex digital designs.
• Logic Capacity 314,880 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory Approximately 25.95 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing tasks.
• I/O Count Up to 720 general-purpose I/O pins for broad peripheral and system interfacing.
• Power Core supply voltage range of 950 mV to 1.05 V to match system power architectures and enable predictable power budgeting.
• Package and Mounting 1759-BBGA / 1759-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for PCB assembly.
• Grade and Temperature Commercial grade with an operating temperature range of 0°C to 85°C for standard commercial applications.
• RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing.

Typical Applications

• High-density Logic Implementations Use the large pool of logic elements to consolidate functions that would otherwise require multiple discrete devices.
• Memory-intensive Processing Leverage approximately 25.95 Mbits of embedded RAM for data buffering, packet buffering, and streaming applications.
• High I/O Systems Integrate with numerous peripherals and external interfaces using up to 720 I/O pins for flexible system designs.
• Custom Digital Signal Processing Deploy the device where substantial programmable logic and on-chip RAM are needed for tailored DSP pipelines.

Unique Advantages

• Large Logic Resource: 314,880 logic elements enable integration of complex state machines, custom processors, and large combinational logic blocks on a single device.
• Significant On-chip Memory: Approximately 25.95 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level design.
• Extensive I/O Capability: Up to 720 I/O pins provide versatility for connecting multiple interfaces, sensors, and high-pin-count peripherals.
• Commercial-grade Specification: Specified for 0°C to 85°C operation, matching typical commercial application environments and deployment scenarios.
• Industry-standard Package: 1759-FCBGA (42.5 × 42.5 mm) surface-mount package supports established assembly processes and board layouts.
• Regulatory Compliance: RoHS compliance facilitates use in lead-free manufacturing environments.

Why Choose XC6VSX315T-2FF1759C?

The XC6VSX315T-2FF1759C combines a high logic element count, substantial embedded memory, and a large I/O footprint in a single Virtex-6 SXT FPGA package, making it suitable for complex commercial designs that require consolidation of logic, buffering, and extensive interfacing. Its defined supply voltage range and commercial temperature rating provide clear integration parameters for system power and thermal planning.

This device is well suited to design teams and procurement groups looking for a high-density FPGA solution that supports substantial on-chip memory and connectivity while conforming to RoHS requirements and standard surface-mount packaging.

Request a quote or submit an inquiry for pricing and availability for the XC6VSX315T-2FF1759C to evaluate it for your next design.