XC6VSX315T-2FF1156I

The XC6VSX315T-2FF1156I is a Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC from AMD. It offers 314,880 logic elements and approximately 25.95 Mbits of embedded memory, delivering substantial on-chip resources for dense programmable logic implementations.

Featuring up to 600 I/O connections, a core voltage range of 0.95 V to 1.05 V, industrial-grade qualification and an operating range of –40 °C to 100 °C, the device is packaged in a 1156-FCBGA (35×35) surface-mount package for compact, high-density system integration.

Key Features

• High-density logic — Provides 314,880 logic elements to support complex, large-scale programmable logic designs.
• Embedded memory — Approximately 25.95 Mbits of on-chip RAM (25,952,256 bits) for data buffering, LUTs and state storage without relying on external memory.
• Extensive I/O — Up to 600 I/O connections to accommodate high-pin-count interfaces and multiple peripheral connections.
• Power supply — Supports a core voltage supply range from 0.95 V to 1.05 V, matching common FPGA core power rails.
• Package and mounting — Available in a 1156-FCBGA (35×35) / 1156-BBGA package; surface-mount mounting type for modern PCB assembly.
• Industrial temperature and grade — Rated for industrial use with an operating temperature range of –40 °C to 100 °C.
• RoHS compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial systems — Suitable for industrial deployments that require components rated for –40 °C to 100 °C and industrial-grade reliability.
• High-density logic designs — Intended for applications that need hundreds of thousands of logic elements and substantial on-chip memory.
• I/O-intensive implementations — Well suited to designs requiring a large number of external connections, leveraging up to 600 I/O pins.

Unique Advantages

• High logic capacity: 314,880 logic elements enable consolidation of large digital functions onto a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 25.95 Mbits of embedded RAM allows significant buffering and state storage without external memory.
• Large I/O count: Up to 600 I/O pins support multiple interfaces and mezzanine connections, simplifying system-level connectivity.
• Industrial operating range: Rated –40 °C to 100 °C and classified as industrial grade for deployment in temperature-demanding environments.
• Compact BGA packaging: 1156-FCBGA (35×35) package delivers high pin density in a compact surface-mount form factor to save PCB area.
• RoHS compliance: Environmentally compliant manufacture supports lead-free assembly processes.

Why Choose XC6VSX315T-2FF1156I?

The XC6VSX315T-2FF1156I positions itself as a high-density, industrial-grade FPGA suited to designs that require a combination of large programmable logic capacity, substantial on-chip memory and a high I/O count. Its 1156-FCBGA surface-mount package and industrial temperature rating make it appropriate for compact, ruggedized systems.

For engineering teams and procurement focusing on scalability and reliability, this AMD Virtex®-6 SXT FPGA provides measurable on-chip resources and environmental robustness, supporting longer-term design lifecycles where integration density and industrial operating range are priorities.

Request a quote for the XC6VSX315T-2FF1156I to check pricing and availability or to submit a purchase inquiry for your project needs.