XC6VSX315T-1FFG1759I

The XC6VSX315T-1FFG1759I is a high-density Virtex®-6 SXT field programmable gate array (FPGA) from AMD designed for complex digital systems. It integrates a large logic fabric and significant on-chip memory with a high I/O count to address demanding system integration needs.

With 314,880 logic elements, approximately 25.95 Mbits of embedded memory and 720 I/O pins, this industrial-grade device is intended for applications that require substantial logic capacity, extensive connectivity and operation across a wide temperature range.

Key Features

• High Logic Capacity 314,880 logic elements provide the programmable fabric needed for complex digital designs and large-scale logic integration.
• On-Chip Memory Approximately 25.95 Mbits of embedded memory to support buffering, state storage and data-intensive processing within the FPGA.
• Extensive I/O 720 user I/O pins enable broad board-level interfacing and support for numerous parallel interfaces and peripherals.
• Power Supply Core voltage operation specified from 950 mV to 1.05 V to match system power-rail requirements and allow predictable power budgeting.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Package and Mounting Supplied in a 1759-BBGA FCBGA package (supplier package: 1759-FCBGA, 42.5 × 42.5 mm) with surface-mount mounting for compact board implementation.
• Regulatory Compliance RoHS-compliant construction supports environmental requirements for lead-free assembly.

Typical Applications

• Industrial Automation — Large logic and high I/O count support complex control, sequencing and machine-automation tasks across the industrial temperature range.
• Communications Infrastructure — Dense logic and embedded memory enable protocol processing, framing and interface aggregation in communications equipment.
• High-Performance Signal Processing — Substantial on-chip memory and logic resources facilitate real-time data processing and parallel computation workloads.
• Board-Level Prototyping and Development — High I/O and a compact FCBGA package make the device suitable for system prototyping where integration and I/O density are required.

Unique Advantages

• Large Programmable Fabric — 314,880 logic elements reduce the need for multiple devices by accommodating extensive logic on a single FPGA.
• Significant Embedded Memory — Approximately 25.95 Mbits of on-chip RAM supports buffering and local data storage, lowering external memory dependency.
• High I/O Density — 720 I/O pins provide abundant connectivity for complex board-level interfacing and multiple parallel channels.
• Industrial Reliability — Specified operating range from −40 °C to 100 °C and RoHS compliance align the device with industrial deployment requirements.
• Compact, Surface-Mount Package — The 1759-FCBGA (42.5 × 42.5 mm) package enables high-density board layouts while supporting surface-mount assembly.
• Predictable Core Power — Core voltage range of 950 mV to 1.05 V allows straightforward integration with modern power-rail designs.

Why Choose XC6VSX315T-1FFG1759I?

The XC6VSX315T-1FFG1759I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand a large logic resource, substantial on-chip memory and extensive I/O connectivity. Its package and surface-mount mounting allow compact board integration while the specified power and temperature ranges support reliable operation in challenging environments.

This device is suited to engineers and system designers building complex digital systems—where scalability of logic, local memory capacity and high pin-count interfaces translate directly into reduced component count and streamlined board-level designs. Backed by AMD as the manufacturer, the part offers a clear specification set for procurement and integration into production hardware.

Request a quote or submit your purchase inquiry to obtain pricing, availability and lead-time information for the XC6VSX315T-1FFG1759I.