XC6VSX315T-1FF1759I

IC FPGA 720 I/O 1759FCBGA
Part Description

Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 720 25952256 314880 1759-BBGA, FCBGA

Quantity 817 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1759-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1759-BBGA, FCBGANumber of I/O720Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs24600Number of Logic Elements/Cells314880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits25952256

Overview of XC6VSX315T-1FF1759I – Virtex®-6 SXT FPGA, 1759-FCBGA

The XC6VSX315T-1FF1759I is a Virtex-6 SXT Field Programmable Gate Array (FPGA) in a 1759-ball FCBGA package designed for high-density programmable logic implementations. It combines large logic capacity, substantial embedded memory, and a high I/O count to support complex digital systems.

This device is offered in an industrial-grade specification with a supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require robust thermal and voltage operating envelopes.

Key Features

  • Core & logic capacity — 314,880 logic elements provide extensive programmable resources for implementing large-scale digital logic and system functions.
  • Configurable logic blocks — 24,600 CLBs enable broad partitioning of logic for parallel processing and modular design.
  • Embedded memory — Approximately 25.95 Mbits of on-chip RAM supports large data buffers, frame storage, and local scratchpad memory without external memory dependencies.
  • I/O density — 720 user I/Os allow extensive interfacing to peripherals, high-pin-count connectors, and multi-channel I/O requirements.
  • Power supply — Low-voltage core operation from 0.95 V to 1.05 V to match modern power-domain architectures.
  • Package & mounting — 1759-ball FCBGA (42.5 × 42.5 mm) surface-mount package for compact board-level integration.
  • Industrial temperature grade — Specified for −40 °C to 100 °C operation to meet industrial-environment deployment needs.
  • Regulatory — RoHS-compliant construction.

Typical Applications

  • High-density digital processing — Use the large logic and memory resources to implement complex algorithms, custom datapaths, and high-performance logic engines.
  • Multi-channel I/O systems — 720 I/Os support designs that require extensive peripheral connectivity, parallel interfaces, or channelized data paths.
  • Industrial control and automation — Industrial-grade temperature range and packaging make the device suitable for controllers and FPGA-based system modules in industrial environments.

Unique Advantages

  • Significant on-chip logic: 314,880 logic elements allow consolidation of large functions into a single FPGA, reducing external components.
  • Substantial embedded memory: Approximately 25.95 Mbits of RAM supports on-chip buffering and local data storage, minimizing external memory needs.
  • High I/O count: 720 I/Os enable broad connectivity options and simplify board-level routing for multi-interface systems.
  • Industrial-grade operating range: Rated for −40 °C to 100 °C to address temperature-demanding deployments.
  • Compact FCBGA packaging: 1759-ball FCBGA (42.5 × 42.5 mm) balances high pin count with a compact footprint for dense PCB layouts.
  • RoHS compliance: Manufactured to meet current lead-free and hazardous-substance requirements.

Why Choose XC6VSX315T-1FF1759I?

The XC6VSX315T-1FF1759I positions itself as a high-capacity, industrial-grade FPGA option that brings together large logic element counts, significant embedded memory, and extensive I/O in a single FCBGA package. It is well suited for engineers and system designers who need to consolidate complex digital logic and multi-channel interfaces while maintaining a defined industrial operating envelope.

For projects that require scalability, on-chip memory resources, and a high pin count in a compact package, this Virtex-6 SXT device provides a clear, specification-driven platform that supports robust design integration and long-term system deployment.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VSX315T-1FF1759I.

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