XC6VSX315T-1FF1759I
| Part Description |
Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 720 25952256 314880 1759-BBGA, FCBGA |
|---|---|
| Quantity | 817 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1759-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1759-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 24600 | Number of Logic Elements/Cells | 314880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25952256 |
Overview of XC6VSX315T-1FF1759I – Virtex®-6 SXT FPGA, 1759-FCBGA
The XC6VSX315T-1FF1759I is a Virtex-6 SXT Field Programmable Gate Array (FPGA) in a 1759-ball FCBGA package designed for high-density programmable logic implementations. It combines large logic capacity, substantial embedded memory, and a high I/O count to support complex digital systems.
This device is offered in an industrial-grade specification with a supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require robust thermal and voltage operating envelopes.
Key Features
- Core & logic capacity — 314,880 logic elements provide extensive programmable resources for implementing large-scale digital logic and system functions.
- Configurable logic blocks — 24,600 CLBs enable broad partitioning of logic for parallel processing and modular design.
- Embedded memory — Approximately 25.95 Mbits of on-chip RAM supports large data buffers, frame storage, and local scratchpad memory without external memory dependencies.
- I/O density — 720 user I/Os allow extensive interfacing to peripherals, high-pin-count connectors, and multi-channel I/O requirements.
- Power supply — Low-voltage core operation from 0.95 V to 1.05 V to match modern power-domain architectures.
- Package & mounting — 1759-ball FCBGA (42.5 × 42.5 mm) surface-mount package for compact board-level integration.
- Industrial temperature grade — Specified for −40 °C to 100 °C operation to meet industrial-environment deployment needs.
- Regulatory — RoHS-compliant construction.
Typical Applications
- High-density digital processing — Use the large logic and memory resources to implement complex algorithms, custom datapaths, and high-performance logic engines.
- Multi-channel I/O systems — 720 I/Os support designs that require extensive peripheral connectivity, parallel interfaces, or channelized data paths.
- Industrial control and automation — Industrial-grade temperature range and packaging make the device suitable for controllers and FPGA-based system modules in industrial environments.
Unique Advantages
- Significant on-chip logic: 314,880 logic elements allow consolidation of large functions into a single FPGA, reducing external components.
- Substantial embedded memory: Approximately 25.95 Mbits of RAM supports on-chip buffering and local data storage, minimizing external memory needs.
- High I/O count: 720 I/Os enable broad connectivity options and simplify board-level routing for multi-interface systems.
- Industrial-grade operating range: Rated for −40 °C to 100 °C to address temperature-demanding deployments.
- Compact FCBGA packaging: 1759-ball FCBGA (42.5 × 42.5 mm) balances high pin count with a compact footprint for dense PCB layouts.
- RoHS compliance: Manufactured to meet current lead-free and hazardous-substance requirements.
Why Choose XC6VSX315T-1FF1759I?
The XC6VSX315T-1FF1759I positions itself as a high-capacity, industrial-grade FPGA option that brings together large logic element counts, significant embedded memory, and extensive I/O in a single FCBGA package. It is well suited for engineers and system designers who need to consolidate complex digital logic and multi-channel interfaces while maintaining a defined industrial operating envelope.
For projects that require scalability, on-chip memory resources, and a high pin count in a compact package, this Virtex-6 SXT device provides a clear, specification-driven platform that supports robust design integration and long-term system deployment.
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