XC6VLX75T-L1FFG484C

The XC6VLX75T-L1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD, offered in a 484‑ball BGA package. This commercial‑grade FPGA provides a large logic capacity and on‑chip memory suitable for complex digital designs that require substantial programmable logic and I/O in a compact surface‑mount package.

Key device attributes include 74,496 logic elements, approximately 5.75 Mbits of embedded memory, 240 I/Os, and a supply voltage operating range of 870 mV to 930 mV. The device is RoHS compliant and rated for commercial operating temperatures.

Key Features

• Core Logic  74,496 logic elements provide extensive programmable logic resources for implementing complex digital functions.
• Embedded Memory  Approximately 5.75 Mbits of on‑chip RAM to support buffering, frame storage, and intermediate data processing without external memory for many use cases.
• I/O Capability  240 general‑purpose I/Os enable broad interfacing to peripherals, sensors, and external devices within a single FPGA package.
• Power Supply Range  Operates from 870 mV to 930 mV, allowing integration into designs with tightly specified core voltage rails.
• Package and Mounting  Supplied in a 484‑BBGA surface‑mount package; supplier device package listed as 484‑FBGA (23×23) for compact board integration.
• Operating Grade and Temperature  Commercial‑grade device rated for 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Regulatory  RoHS compliant to support lead‑free assembly and regulatory requirements for many commercial products.

Unique Advantages

• High logic capacity: 74,496 logic elements enable substantial on‑chip implementation of complex functions, reducing dependence on multiple discrete devices.
• Significant embedded memory: Approximately 5.75 Mbits of RAM supports large buffers and on‑chip data structures, simplifying board‑level memory requirements.
• Large I/O count: 240 I/Os provide flexibility for multi‑lane interfaces, parallel peripherals, and mixed signal front‑end connectivity.
• Compact BGA package: The 484‑ball FBGA (23×23) footprint balances pin count and board density for space‑constrained designs.
• Commercial suitability: Rated for 0 °C to 85 °C, making it appropriate for a wide range of standard commercial applications without industrial temperature qualification.
• RoHS compliant: Facilitates lead‑free manufacturing and compliance with common environmental regulations.

Why Choose XC6VLX75T-L1FFG484C?

The XC6VLX75T-L1FFG484C positions as a commercial‑grade Virtex‑6 LXT FPGA that combines a large pool of logic elements, meaningful on‑chip RAM, and a high I/O count in a 484‑ball BGA surface‑mount package. These characteristics make it well suited to designers seeking significant programmable logic and memory resources in a compact form factor.

With RoHS compliance, a defined supply voltage window, and a standard commercial temperature rating, this FPGA supports reliable integration into mainstream electronic products and systems where substantial on‑chip resources and board‑level density are priorities.

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