XC6VLX75T-2FFV484I4243
| Part Description |
Virtex®-6 VLX Field Programmable Gate Array (FPGA) IC 240 5750784 74496 484-BBGA, FCBGA |
|---|---|
| Quantity | 538 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 240 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5820 | Number of Logic Elements/Cells | 74496 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5750784 |
Overview of XC6VLX75T-2FFV484I4243 – Virtex®-6 VLX FPGA, 484-FCBGA, Industrial Grade
The XC6VLX75T-2FFV484I4243 is a Virtex®-6 VLX Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a large programmable logic fabric with substantial on-chip memory and a broad I/O complement, suitable for embedded systems and industrial control designs.
Key attributes include 74,496 logic elements, approximately 5.75 Mbits of embedded memory, 240 user I/Os, a 484-ball FCBGA package (23 × 23), and an industrial operating temperature range from −40 °C to 100 °C.
Key Features
- Programmable Logic Fabric 74,496 logic elements provide a scalable resource pool for implementing custom logic, data paths, and control functions.
- Embedded Memory Approximately 5.75 Mbits of on-chip RAM for buffering, frame storage, and fast local data access without external memory.
- High I/O Count 240 user I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-ends.
- Power Supply Core voltage operating range from 950 mV to 1.05 V to match common FPGA power architectures.
- Package 484-FCBGA (23 × 23) package option provides a compact, high-density ball-grid footprint suitable for surface-mount assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, addressing temperature requirements in industrial environments.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.
Typical Applications
- Industrial Control: Implement motor control, programmable logic, and real-time control functions using the large logic capacity and extended temperature rating.
- Embedded Systems: Integrate custom peripherals and processing pipelines with on-chip RAM and abundant I/Os for sensor and actuator interfacing.
- Data Acquisition and Processing: Use on-chip memory and high I/O count for buffering and preprocessing of sensor or instrumentation data streams.
Unique Advantages
- Large Logic Capacity: 74,496 logic elements enable complex designs and parallel processing architectures without immediate need for multiple devices.
- Significant On‑Chip Memory: Approximately 5.75 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and temporary storage.
- High I/O Flexibility: 240 user I/Os provide the flexibility to connect multiple interfaces, buses, and peripherals directly to the FPGA.
- Industrial Reliability: Rated for −40 °C to 100 °C operation, making the device suitable for harsh or temperature-variable environments.
- Compact High‑Density Package: 484-FCBGA (23 × 23) offers a space-efficient form factor for high-pin-count FPGA integration on modern PCBs.
- RoHS Compliance: Supports lead-free manufacturing processes and environmental regulatory goals.
Why Choose XC6VLX75T-2FFV484I4243?
The XC6VLX75T-2FFV484I4243 positions itself as a high-capacity, industrial-grade FPGA option from AMD’s Virtex‑6 family. With 74,496 logic elements, approximately 5.75 Mbits of embedded memory, and 240 I/Os in a 484-FCBGA package, it is well suited for complex embedded and industrial control designs that require on-chip processing, buffering, and a high degree of I/O integration.
This device offers a balance of integration, thermal robustness, and board-level density for designers seeking a long-term solution that supports scalable logic and memory requirements while complying with RoHS directives.
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