XC6VLX75T-3FF484C

The XC6VLX75T-3FF484C is a Virtex®-6 LXT field programmable gate array (FPGA) offered in a 484-ball FCBGA package. It provides a high-density programmable logic fabric with substantial on-chip memory and a large complement of I/O for complex digital designs.

Designed for commercial-grade applications, this device targets systems that require significant logic capacity, embedded RAM, and broad I/O connectivity while operating within a 0 °C to 85 °C temperature range and a 0.95–1.05 V core supply window.

Key Features

• Logic Capacity  Approximately 74,496 logic elements distributed across the device to implement complex digital functions and custom logic blocks.
• Configurable Logic Blocks (CLBs)  The device reports 5,820 CLBs for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM, enabling local storage for buffering, state machines, and data processing without external memory.
• I/O Density  240 user I/O pins provide broad external connectivity for sensors, interfaces, and parallel data paths.
• Power  Core supply range of 0.95 V to 1.05 V for compatibility with targeted power domains and voltage planning.
• Package & Mounting  Supplied in a 484-FCBGA (23 × 23 mm) package case (484-BBGA, FCBGA) designed for surface mount assembly.
• Temperature & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS-compliant construction supporting environmental compliance requirements.

Typical Applications

• Custom Digital Logic  Implement application-specific logic and state machines using the device’s ~74,496 logic elements and CLB resources.
• Embedded Memory Functions  Use the approximately 5.75 Mbits of on-chip RAM for buffering, look-up tables, and local data storage to reduce external memory needs.
• I/O-Intensive Interfaces  Deploy the 240 I/Os for systems that require multiple parallel interfaces, sensor arrays, or multi-channel connectivity.
• High-Density Board Integration  The 484-FCBGA package supports compact, surface-mount board designs where package density and connectivity are priorities.

Unique Advantages

• High Logic Density: Large logic element count enables integration of complex digital functions onto a single device, reducing system BOM.
• Significant On-Chip Memory: Approximately 5.75 Mbits of embedded RAM allow for local data handling and lower dependency on external memory components.
• Extensive I/O Count: 240 I/Os provide versatility for connecting to multiple peripherals and interfaces without additional bridge devices.
• Compact, Surface-Mount Package: The 484-FCBGA (23 × 23 mm) package facilitates dense PCB layouts and automated assembly.
• Commercial Grade Operation: Specified for 0 °C to 85 °C operation to match standard commercial electronic product requirements.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory and supply-chain requirements.

Why Choose XC6VLX75T-3FF484C?

The XC6VLX75T-3FF484C positions itself as a high-density Virtex®-6 LXT FPGA option for commercial designs that require a large number of logic elements, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its combination of resources supports integration of complex digital subsystems onto a single device, helping simplify board-level design and component selection.

This device is suited for engineering teams and system designers focused on dense programmable logic implementations and I/O-rich interfaces who need a commercially graded FPGA with a defined temperature and voltage envelope and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX75T-3FF484C and to discuss how it can fit your next programmable logic design.