XC6VLX75T-3FFG484C

The XC6VLX75T-3FFG484C is an AMD Virtex®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 484-BBGA package. It integrates a large logic fabric, on-chip memory, and a substantial I/O complement to address complex digital system requirements.

With 74,496 logic elements, approximately 5.75 Mbits of embedded memory, and 240 user I/Os, this surface-mount, commercial-grade FPGA targets designs that require dense programmable logic, sizable local storage, and a compact board footprint. It operates from a core supply of 0.95 V to 1.05 V and across a 0 °C to 85 °C temperature range.

Key Features

• Core logic: Approximately 74,496 logic elements implemented across 5,820 CLBs, enabling substantial flexible logic capacity for custom digital functions.
• Embedded memory: Approximately 5.75 Mbits of on-chip RAM for local data buffering, state storage, and algorithmic memory requirements.
• I/O and package: 240 user I/Os in a 484-BBGA package (supplier device package: 484-FBGA, 23×23), supporting dense connectivity in a compact BGA footprint.
• Power: Core voltage supply range of 0.95 V to 1.05 V for the FPGA core.
• Thermal and grade: Commercial operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Mounting and compliance: Surface-mount device that is RoHS compliant for regulatory and assembly compatibility.

Typical Applications

• Custom digital processing: Use the large logic element count and CLB structure to implement bespoke datapath and control logic for signal processing or protocol handling.
• Memory‑intensive functions: Leverage approximately 5.75 Mbits of embedded RAM for buffering, lookup tables, or on-chip storage to reduce external memory dependence.
• High-density I/O interfaces: Take advantage of 240 I/Os in the 484-BBGA package to connect multiple peripherals, sensors, or interface blocks in space-constrained designs.

Unique Advantages

• High logic density: Approximately 74,496 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Significant embedded memory: Around 5.75 Mbits of on-chip RAM supports data buffering and local storage, simplifying memory architecture and improving latency.
• Ample I/O in a compact footprint: 240 user I/Os delivered in a 484-BBGA (23×23) package enable dense external connectivity while maintaining a small PCB area.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation to match standard commercial system environments.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose XC6VLX75T-3FFG484C?

The XC6VLX75T-3FFG484C positions itself as a highly integrated FPGA option for designers who need a substantial logic fabric, on-chip memory, and broad I/O capability in a compact BGA package. Its combination of approximately 74,496 logic elements, roughly 5.75 Mbits of embedded RAM, and 240 I/Os supports consolidation of multiple functions and streamlined board designs.

Designed and documented by AMD, this Virtex‑6 LXT device is suitable for commercial electronic systems requiring dense programmable logic and local memory resources. Manufacturer documentation is available to support design integration, configuration, and validation throughout the development cycle.

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