XC6VLX75T-2FFG484I

The XC6VLX75T-2FFG484I is an AMD Virtex®-6 LXT field programmable gate array provided in a 484‑ball BGA package. It delivers a large logic capacity with 74,496 logic elements and embedded memory suitable for dense digital designs.

Targeted for industrial applications, this surface-mount FPGA offers a broad I/O count and on-chip RAM to implement complex control, data-path, and mid-to-high density signal processing functions within a compact 23 × 23 mm package footprint.

Key Features

• Logic Capacity  74,496 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Count  240 user I/O pins to interface with multiple peripherals, buses, and external devices.
• Power Supply  Core voltage specified at 0.95 V to 1.05 V, enabling defined power sequencing and supply planning for the design.
• Package & Mounting  484‑BBGA (supplier package: 484‑FBGA, 23 × 23 mm) optimized for surface-mount assembly and high-density board layouts.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implements motion control, PLC logic, and custom timing/state machines where industrial temperature range and reliability are required.
• Communications Equipment  Handles protocol bridging, packet buffering, and custom logic for infrastructure equipment requiring many I/Os and on-chip RAM.
• Test & Measurement  Performs data acquisition front-end logic, trigger/control functions, and real-time processing using the device's logic and embedded memory.
• High-Density Digital Systems  Consolidates multiple custom functions into a single FPGA to reduce BOM and simplify board-level integration.

Unique Advantages

• Substantial Logic Resources: The 74,496 logic elements provide headroom for large state machines, custom datapaths, and feature-rich designs.
• Significant On-Chip RAM: Approximately 5.75 Mbits of embedded memory reduces dependence on external RAM for buffering and local storage.
• High I/O Density: 240 I/O pins enable connectivity to multiple peripherals and interfaces without extensive external multiplexing.
• Industrial Temperature Qualification: Rated for −40 °C to 100 °C operation, suitable for deployment in harsh or temperature-variable environments.
• Compact BGA Package: The 484‑BBGA (23 × 23 mm) form factor supports compact board layouts while maintaining signal density.
• Defined Core Voltage Range: A core supply window of 0.95 V to 1.05 V helps with power planning and regulator selection in system design.

Why Choose XC6VLX75T-2FFG484I?

The XC6VLX75T-2FFG484I positions itself as a high-capacity Virtex‑6 LXT FPGA option for industrial and high-density digital designs that require substantial logic, on-chip memory, and extensive I/O in a compact BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for demanding environments where long-term reliability is a consideration.

This device is appropriate for engineers building systems that need integration of multiple digital functions into a single programmable device—reducing board complexity and enabling flexible hardware updates throughout the product lifecycle.

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