XC6VLX75T-2FFG484C

The XC6VLX75T-2FFG484C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD, offered in a 484-BBGA surface-mount package. It provides a balance of programmable logic capacity, embedded memory, and I/O density for commercial-temperature applications.

Configured for systems that require on-chip programmable logic, the device integrates a large number of logic elements and embedded RAM while operating over a core voltage range of 0.95–1.05 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 74,496 logic elements and 5,820 configurable logic blocks to implement complex digital functions.
• Embedded Memory  Approximately 5.75 Mbits of on-chip RAM (5,750,784 total RAM bits) for buffering, lookup tables, and local storage.
• I/O Resources  240 user I/O pins to support a variety of board-level interfaces and parallel connectivity.
• Package and Mounting  484-BBGA surface-mount package; supplier device package listed as 484-FBGA (23×23) for compact board integration.
• Power  Core supply voltage range from 0.95 V to 1.05 V, enabling defined power provisioning for the FPGA core.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Programmable Logic Systems  Used to implement custom digital functions and control logic where on-chip reconfiguration is required.
• Embedded Memory-Intensive Designs  Suitable for designs that need several megabits of local RAM for buffering, LUTs, or small data stores.
• I/O-Driven Boards  Ideal for systems requiring a high number of general-purpose I/Os for board-level interfacing and parallel data connections.

Unique Advantages

• High Logic Density: Approximately 74,496 logic elements enable implementation of complex digital algorithms and custom datapaths.
• Substantial On-Chip Memory: Approximately 5.75 Mbits of embedded RAM reduce dependence on external memory for moderate buffering and lookup requirements.
• Ample I/O: 240 I/O pins provide flexibility for connecting peripherals, sensors, and external interfaces without extensive adapter logic.
• Compact Surface-Mount Package: 484-BBGA (supplier package 484-FBGA, 23×23) helps save board space while supporting high-density integration.
• Defined Power Envelope: Core voltage range of 0.95–1.05 V enables predictable power design and supply planning.
• Commercial Temperature Range: Rated for 0 °C to 85 °C for standard commercial deployments.

Why Choose XC6VLX75T-2FFG484C?

The XC6VLX75T-2FFG484C combines a large logic element count, several megabits of embedded memory, and substantial I/O capacity in a compact 484-BBGA surface-mount package from AMD's Virtex®-6 LXT family. Its core voltage range and commercial operating temperature make it suitable for a wide range of standard electronic systems that require programmable logic integration.

This device is well suited to designers who need on-chip resources for moderate-scale digital implementation, local memory, and flexible I/O without moving to larger form-factor packages. The combination of logic, memory, and I/O helps minimize external components and supports streamlined board-level integration.

If you would like pricing, availability, or to request a quote for XC6VLX75T-2FFG484C, submit an inquiry or request a quote today.