XC6VSX315T-1FFG1156I

The XC6VSX315T-1FFG1156I is a Virtex®-6 SXT Field Programmable Gate Array (FPGA) from AMD. It delivers a high-density programmable fabric with 314,880 logic elements and approximately 26 Mbits of embedded memory for complex digital designs.

Packaged in a 1156-FCBGA (35 × 35 mm) surface-mount package and specified for industrial operation, this device provides 600 user I/Os and operates over a core supply range of 950 mV to 1.05 V with an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Capacity — 314,880 logic elements provide a large programmable fabric for implementing complex logic, DSP blocks, and custom hardware accelerators.
• Embedded Memory — Approximately 26 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive functions.
• I/O Density — 600 user I/Os to enable high pin-count interfaces and flexible connectivity options.
• Package and Mounting — 1156-BBGA / 1156-FCBGA (35×35) surface-mount package suitable for compact, high-density PCB designs.
• Power — Core voltage supply range of 950 mV to 1.05 V for compatibility with target system power rails.
• Industrial Grade — Rated for an operating temperature range of −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density hardware acceleration — Use the large logic capacity and embedded memory to implement custom accelerators and parallel processing blocks.
• High-pin-count interface systems — 600 I/Os support multiple external interfaces and complex routing requirements.
• Industrial control and processing — Industrial-grade temperature range and robust packaging make the device suitable for embedded industrial electronics.

Unique Advantages

• Significant logic resources: 314,880 logic elements enable complex, large-scale designs without compromising on integration.
• Substantial on-chip memory: Approximately 26 Mbits of embedded RAM reduces dependence on external memory and improves data-path performance.
• High I/O count: 600 user I/Os simplify system-level integration with multiple peripherals and high-speed interfaces.
• Industrial temperature specification: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact, manufacturable package: 1156-FCBGA (35×35) surface-mount package supports compact board layouts and automated assembly.
• RoHS compliance: Meets lead-free manufacturing requirements.

Why Choose XC6VSX315T-1FFG1156I?

The XC6VSX315T-1FFG1156I balances high logic capacity, sizable embedded memory, and extensive I/O in a single industrial-grade FPGA package. Its combination of 314,880 logic elements, approximately 26 Mbits of on-chip RAM and 600 I/Os makes it well suited to demanding, integration-heavy designs that require significant programmable resources and robust operation across a wide temperature range.

Designed for engineers and procurement teams seeking a high-density FPGA with industrial specifications and RoHS compliance, this Virtex‑6 SXT device provides scalability and platform-level capability for sophisticated embedded and processing applications.

Request a quote or submit an inquiry for pricing and availability of the XC6VSX315T-1FFG1156I to begin your procurement or design evaluation process.