XC6VSX315T-1FFG1156C

The XC6VSX315T-1FFG1156C is a Virtex-6 SXT field programmable gate array (FPGA) from AMD, delivered in a 1156-ball FCBGA package. It provides high logic capacity and substantial on-chip memory for complex, programmable digital designs.

With 314,880 logic elements, approximately 26 Mbits of embedded memory and up to 600 user I/O pins, this device targets designs that require dense logic integration, significant local buffering and flexible I/O connectivity while operating within a 0.95–1.05 V core voltage range.

Key Features

• Core Logic  314,880 logic elements (logic element cells) to support large-scale, programmable logic implementations.
• Embedded Memory  Approximately 26 Mbits of on-chip RAM (25,952,256 bits) for local data buffering, FIFOs and memory-intensive functions.
• I/O Capacity  Up to 600 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power  Core voltage supply range of 0.95 V to 1.05 V to define power-supply requirements and system integration constraints.
• Package  1156-ball BGA (1156-FCBGA, 35 × 35 mm) surface-mount package for high-density PCB integration.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• High-density digital processing  Use the large logic element count for complex state machines, data-path accelerators and algorithmic pipelines.
• Memory-intensive designs  Leverage approximately 26 Mbits of embedded RAM for buffering, on-chip caches or large FIFO structures.
• I/O-rich systems  Support multi-channel interfaces, parallel buses or mixed-signal front-ends with up to 600 I/O pins.

Unique Advantages

• High logic capacity: 314,880 logic elements enable consolidation of large functions into a single FPGA, reducing board-level complexity.
• Significant on-chip RAM: Approximately 26 Mbits of embedded memory provides local storage to improve throughput and minimize external memory dependence.
• Extensive I/O: 600 user I/Os allow flexible interfacing with peripherals, sensors and parallel data streams without external multiplexing.
• Compact, production-ready package: The 1156-FCBGA (35 × 35 mm) package supports surface-mount assembly for compact, high-density PCBs.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.

Why Choose XC6VSX315T-1FFG1156C?

The XC6VSX315T-1FFG1156C positions itself as a high-capacity Virtex-6 SXT FPGA offering a balance of extensive logic resources, substantial embedded memory and broad I/O capability in a single 1156-ball FCBGA package. Its specifications suit teams consolidating complex digital functions and memory-heavy blocks onto one device while maintaining defined power and thermal parameters.

Backed by AMD manufacturing and provided as a RoHS-compliant commercial-grade device, it is appropriate for developers and design teams seeking scalable logic integration and on-chip memory for compute- and I/O-intensive applications.

Request a quote or submit your requirements to get pricing and availability for the XC6VSX315T-1FFG1156C. Our team can provide ordering information and assist with integration details for your design.