XC6VSX315T-2FF1759I

The XC6VSX315T-2FF1759I is a Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC from AMD in a 1759-FCBGA surface-mount package. It delivers high logic capacity, substantial on-chip memory, and a large number of I/Os for designs that require dense programmable logic and extensive interfacing.

Targeted for industrial applications, this device combines 314,880 logic elements with approximately 25.95 Mbits of embedded memory and 720 I/Os, offering a balanced platform for I/O-heavy, compute-oriented designs that must operate across a wide temperature range.

Key Features

• Logic Resources  314,880 logic elements provide significant programmable logic capacity for complex custom functions and parallel processing architectures.
• Embedded Memory  Approximately 25.95 Mbits of on-chip RAM support data buffering, intermediate storage, and state memory without immediately requiring external memory devices.
• I/O Density  720 user I/Os enable extensive peripheral interfacing and complex routing for multi-protocol or multi-channel applications.
• Power Supply  Core voltage supply range from 0.95 V to 1.05 V allows designers to plan power delivery and thermal profiles consistent with the device's requirements.
• Package & Mounting  1759-FCBGA (42.5 × 42.5 mm) ball-grid array package in a surface-mount form factor supports high pin count integration in space-constrained layouts.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for industrial-temperature environments.
• RoHS Compliant  Device is RoHS compliant for lead-free manufacturing processes and environmental regulatory alignment.

Typical Applications

• Industrial Control Systems  Implement custom control logic, real-time decision-making, and interface aggregation while meeting industrial temperature requirements.
• High‑density Data Processing  Use the large logic and embedded memory resources for packet processing, parallel algorithms, or data aggregation tasks.
• I/O‑intensive Interface Hubs  Support multiple peripherals and protocol bridges with 720 I/Os, reducing the need for external multiplexing or glue logic.
• Test & Measurement Equipment  Deploy reconfigurable logic and on-chip memory to handle signal conditioning, acquisition control, and data buffering in benchtop and rack systems.

Unique Advantages

• High logic capacity: 314,880 logic elements provide headroom for complex designs and feature growth without immediate part changes.
• Substantial on‑chip RAM: Approximately 25.95 Mbits of embedded memory reduces dependence on external memory for many buffering and state storage needs.
• Extensive I/O count: 720 I/Os enable broad peripheral connectivity and multi-channel interfacing in a single device.
• Industrial temperature capability: Rated for −40 °C to 100 °C, the device is suitable for industrial environments requiring extended temperature operation.
• Compact high‑pin‑count package: 1759-FCBGA (42.5 × 42.5 mm) allows integration of high I/O and logic density in a surface-mount footprint.
• Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports predictable power planning for system designers.

Why Choose XC6VSX315T-2FF1759I?

The XC6VSX315T-2FF1759I delivers a combination of high logic density, sizable embedded memory, and very large I/O count within an industrial-grade FCBGA package. These attributes make it a strong choice for engineers building I/O-intensive, compute‑heavy systems that must operate across a wide temperature range.

For teams needing a scalable programmable platform with significant on-chip resources and a compact high-pin-count package, this Virtex®-6 SXT device offers the integration and robustness required to reduce external components and simplify board-level architecture.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6VSX315T-2FF1759I.