XC6VSX315T-2FFG1759I

The XC6VSX315T-2FFG1759I is a Virtex®-6 SXT field programmable gate array supplied in a 1759-FCBGA (42.5 × 42.5 mm) package. It provides large on-chip logic capacity and embedded memory, and is supplied in an industrial-grade device rated for an operating range of -40 °C to 100 °C.

Designed for projects that require substantial logic resources and wide I/O, this device combines 314,880 logic elements with approximately 25.95 Mbits of embedded RAM and 720 user I/O pins. It is a surface-mount device with a core voltage supply range of 0.95 V to 1.05 V and is RoHS compliant.

Key Features

• Core logic — 314,880 logic elements to support large-scale programmable designs and complex digital implementations.
• Embedded memory — Approximately 25.95 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• Extensive I/O — 720 user I/O pins to accommodate high-channel count interfaces and broad system connectivity.
• Package and mounting — 1759-BBGA / 1759-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for dense board integration.
• Power — Core supply voltage range from 0.95 V to 1.05 V to match system power architectures.
• Industrial operating range — Rated for -40 °C to 100 °C operation and identified as industrial grade.
• Regulatory — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Complex digital systems — Implement large-scale programmable logic using 314,880 logic elements for custom control, protocol bridging, and state-machine implementations.
• Memory-intensive designs — Leverage approximately 25.95 Mbits of embedded RAM for buffering, packet storage, or local data processing.
• High-channel I/O systems — Use 720 I/O pins to support multi-channel interfaces, dense sensor arrays, or broad peripheral connectivity.

Unique Advantages

• High logic capacity: 314,880 logic elements enable implementation of large and complex digital functions on a single device, reducing the need for multiple FPGAs.
• Significant on-chip memory: Approximately 25.95 Mbits of embedded RAM supports memory-heavy functions without external memory dependence.
• Broad I/O availability: 720 I/O pins provide flexibility for high-density I/O routing and interfacing to many peripherals or channels.
• Industrial temperature rating: Operation from -40 °C to 100 °C suits deployments that require robustness across a wide thermal envelope.
• Compact FCBGA footprint: The 1759-FCBGA (42.5 × 42.5 mm) package offers a high-density assembly option for space-conscious board designs.
• RoHS compliant: Complies with lead-free manufacturing requirements for environmentally conscious production.

Why Choose XC6VSX315T-2FFG1759I?

The XC6VSX315T-2FFG1759I positions itself for designs that demand substantial programmable logic, generous embedded memory, and high I/O counts within an industrial-grade package. Its combination of 314,880 logic elements, approximately 25.95 Mbits of on-chip RAM, and 720 user I/O pins makes it suitable for consolidated implementations where board real estate and integration matter.

For engineers and procurement teams building systems that require scalable logic capacity, broad interfacing, and operation across a wide temperature range, this device offers a balanced set of capabilities and a compact FCBGA footprint, while meeting RoHS requirements.

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