XC6VSX315T-3FFG1156C

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 600 25952256 314880 1156-BBGA, FCBGA

Quantity 837 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs24600Number of Logic Elements/Cells314880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits25952256

Overview of XC6VSX315T-3FFG1156C – Virtex®-6 SXT Field Programmable Gate Array (FPGA), 1156‑FCBGA

The XC6VSX315T-3FFG1156C is a Virtex®-6 SXT family FPGA IC designed for commercial applications. It provides a large logic resource set, on-chip RAM, and extensive I/O in a 1156‑FCBGA package for use in high-density programmable logic designs.

Key on-chip resources include 314,880 logic elements, approximately 25.95 Mbits of embedded memory, and 600 I/O pins. The device is supplied in a 1156‑FBGA (35×35) surface-mount package and operates at a core supply range of 950 mV to 1.05 V with a commercial temperature rating of 0°C to 85°C.

Key Features

  • Core Logic Capacity 314,880 logic elements for large-scale logic and routing implementations.
  • Embedded Memory Approximately 25.95 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage.
  • I/O Resources 600 user I/O pins to accommodate multiple interfaces and high-pin-count system connections.
  • Package and Mounting 1156‑FCBGA (1156‑BBGA) package in a 35×35 format, optimized for surface-mount PCB assembly.
  • Power Core supply range of 950 mV to 1.05 V enabling integration with standard system power rails.
  • Operating Grade and Temperature Commercial grade with an operating temperature range of 0°C to 85°C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 314,880 logic elements provide the resources needed for complex FPGA designs without external logic.
  • Substantial embedded memory: Approximately 25.95 Mbits of on-chip RAM reduces dependence on off-chip memory for many buffering and storage tasks.
  • Extensive I/O availability: 600 I/O pins support multiple interfaces and high-density connectivity options on a single device.
  • Compact high‑pin package: The 1156‑FCBGA (35×35) package delivers high pin count in a space-efficient surface-mount form factor.
  • Controlled power envelope: Core voltage range of 950 mV–1.05 V aligns with contemporary power distribution designs.
  • Commercial suitability: Rated for 0°C to 85°C operation for applications targeting commercial environments.

Why Choose XC6VSX315T-3FFG1156C?

The XC6VSX315T-3FFG1156C positions a large Virtex®-6 SXT FPGA resource set—314,880 logic elements and approximately 25.95 Mbits of embedded memory—into a 1156‑FCBGA surface-mount package with 600 I/O. This combination supports dense, high-pin-count designs that require substantial on-chip logic and memory resources within commercial temperature constraints.

For teams designing complex, programmable hardware where on-chip capacity, I/O richness, and a compact FCBGA footprint matter, this device offers a balance of integration and scalability backed by documented device specifications and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability of the XC6VSX315T-3FFG1156C to begin design planning and procurement.

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