XC6VSX315T-3FFG1156C
| Part Description |
Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 600 25952256 314880 1156-BBGA, FCBGA |
|---|---|
| Quantity | 837 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 24600 | Number of Logic Elements/Cells | 314880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25952256 |
Overview of XC6VSX315T-3FFG1156C – Virtex®-6 SXT Field Programmable Gate Array (FPGA), 1156‑FCBGA
The XC6VSX315T-3FFG1156C is a Virtex®-6 SXT family FPGA IC designed for commercial applications. It provides a large logic resource set, on-chip RAM, and extensive I/O in a 1156‑FCBGA package for use in high-density programmable logic designs.
Key on-chip resources include 314,880 logic elements, approximately 25.95 Mbits of embedded memory, and 600 I/O pins. The device is supplied in a 1156‑FBGA (35×35) surface-mount package and operates at a core supply range of 950 mV to 1.05 V with a commercial temperature rating of 0°C to 85°C.
Key Features
- Core Logic Capacity 314,880 logic elements for large-scale logic and routing implementations.
- Embedded Memory Approximately 25.95 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage.
- I/O Resources 600 user I/O pins to accommodate multiple interfaces and high-pin-count system connections.
- Package and Mounting 1156‑FCBGA (1156‑BBGA) package in a 35×35 format, optimized for surface-mount PCB assembly.
- Power Core supply range of 950 mV to 1.05 V enabling integration with standard system power rails.
- Operating Grade and Temperature Commercial grade with an operating temperature range of 0°C to 85°C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 314,880 logic elements provide the resources needed for complex FPGA designs without external logic.
- Substantial embedded memory: Approximately 25.95 Mbits of on-chip RAM reduces dependence on off-chip memory for many buffering and storage tasks.
- Extensive I/O availability: 600 I/O pins support multiple interfaces and high-density connectivity options on a single device.
- Compact high‑pin package: The 1156‑FCBGA (35×35) package delivers high pin count in a space-efficient surface-mount form factor.
- Controlled power envelope: Core voltage range of 950 mV–1.05 V aligns with contemporary power distribution designs.
- Commercial suitability: Rated for 0°C to 85°C operation for applications targeting commercial environments.
Why Choose XC6VSX315T-3FFG1156C?
The XC6VSX315T-3FFG1156C positions a large Virtex®-6 SXT FPGA resource set—314,880 logic elements and approximately 25.95 Mbits of embedded memory—into a 1156‑FCBGA surface-mount package with 600 I/O. This combination supports dense, high-pin-count designs that require substantial on-chip logic and memory resources within commercial temperature constraints.
For teams designing complex, programmable hardware where on-chip capacity, I/O richness, and a compact FCBGA footprint matter, this device offers a balance of integration and scalability backed by documented device specifications and RoHS compliance.
Request a quote or submit an inquiry for pricing and availability of the XC6VSX315T-3FFG1156C to begin design planning and procurement.

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