XC6VSX315T-L1FFG1759C

The XC6VSX315T-L1FFG1759C is a Virtex-6 SXT field programmable gate array (FPGA) in a 1759-ball FCBGA package. It delivers a high logic element count and substantial on-chip RAM, combined with a large I/O complement and a compact 42.5 × 42.5 mm package footprint for surface-mount applications.

Designed for commercial-grade systems, this FPGA targets designs that require high integration density, extensive on-chip memory, and flexible I/O in a single-package programmable device.

Key Features

• Core Logic  314,880 logic elements provide substantial programmable logic capacity for complex, custom digital designs.
• Embedded Memory  Approximately 26 Mbits of embedded memory (25,952,256 bits) for buffering, lookup tables, and on-chip data storage.
• I/O Capacity  720 user I/O pins to support wide parallel interfaces and high-pin-count connectivity requirements.
• Package & Mounting  1759-BBGA/1759-FCBGA surface-mount package with a supplier device package dimension of 1759-FCBGA (42.5 × 42.5 mm) for dense mounting and system-level integration.
• Power Supply  Specified core voltage range from 870 mV to 930 mV to match system power-rail requirements.
• Operating Temperature  Commercial operating range from 0 °C to 85 °C suitable for standard commercial electronics deployments.
• Regulatory  RoHS-compliant construction to meet common environmental and materials requirements.
• Mounting Type  Surface mount device optimized for modern PCB assembly processes.

Unique Advantages

• High logic density: 314,880 logic elements enable implementation of complex, custom logic functions without external gate arrays.
• Large on-chip memory: Approximately 26 Mbits of embedded RAM reduces reliance on off-chip memory and lowers system BOM complexity for buffering and data storage.
• Extensive I/O integration: 720 I/O pins accommodate wide buses, multiple interfaces, and high-channel-count systems within one device.
• Compact, high-pin-count package: 1759-FCBGA (42.5 × 42.5 mm) offers a balance of I/O density and board-space efficiency for space-constrained designs.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Low-voltage core operation: 870–930 mV supply window supports modern power-optimized designs.

Why Choose XC6VSX315T-L1FFG1759C?

The XC6VSX315T-L1FFG1759C positions itself as a high-density, high-integration FPGA solution for commercial applications where substantial programmable logic, on-chip memory, and abundant I/O are essential. Its 314,880 logic elements and approximately 26 Mbits of embedded RAM provide the resources to consolidate functions that might otherwise require multiple devices.

Engineers and procurement teams deploying complex digital systems will find value in the device’s combination of logic capacity, I/O count, and a compact 1759-FCBGA package—delivering scalability and system-level integration while maintaining RoHS compliance and a standard commercial operating range.

Request a quote or submit a purchase inquiry to get pricing and availability for XC6VSX315T-L1FFG1759C. Our team can provide lead-time and ordering information to support your design and production planning.