XC6VSX475T-1FFG1759I

The XC6VSX475T-1FFG1759I is a Virtex®-6 SXT field programmable gate array offering high logic density and on-chip memory in a 1759-ball FCBGA package. It combines a large number of logic elements with substantial embedded RAM and a high I/O count for complex, I/O‑heavy digital designs.

Designed for industrial applications, the device operates over a wide temperature range and supports surface-mount assembly, making it suitable for deployed systems that require robust environmental performance and high integration.

Key Features

• Logic Capacity 476,160 logic elements and 37,200 CLBs provide the resources required for large, complex logic implementations.
• Embedded Memory Approximately 39.22 Mbits of on-chip RAM to support buffering, lookup tables, and memory‑intensive algorithms.
• I/O Integration 840 user I/O pins enable extensive peripheral, interface, and mezzanine connectivity for I/O‑dense systems.
• Core Supply Core voltage supply range of 0.95 V to 1.05 V to match system power architectures.
• Package & Mounting 1759‑FCBGA package (42.5 × 42.5 mm) in a surface‑mount form factor for compact board-level integration.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density logic designs Implement complex state machines, custom datapaths, and large-scale logic functions using the device's substantial logic element budget.
• I/O-intensive systems Support multiple external interfaces and parallel peripherals with 840 available I/O pins.
• Memory-dependent architectures Use approximately 39.22 Mbits of embedded memory for on-chip buffering, packet storage, and LUT-based functions.
• Industrial control and automation Industrial grade operation and a wide temperature range make the FPGA suitable for control systems and deployed industrial equipment.

Unique Advantages

• Highly integrated logic and memory: 476,160 logic elements and substantial on-chip RAM reduce dependence on external components and simplify board design.
• Large I/O footprint: 840 I/Os enable dense peripheral connectivity and flexible system I/O partitioning.
• Industrial temperature capability: −40 °C to 100 °C operation supports designs that must withstand harsh environments.
• Compact FCBGA packaging: 1759‑ball FCBGA (42.5 × 42.5 mm) balances high pin count with a surface‑mount footprint suitable for modern PCB layouts.
• Controlled core voltage range: 0.95 V to 1.05 V core supply allows predictable power budgeting and compatibility with regulated power systems.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assembly processes.

Why Choose XC6VSX475T-1FFG1759I?

The XC6VSX475T-1FFG1759I positions itself as a high‑capacity Virtex®-6 SXT FPGA for designs that require a combination of large logic resources, significant on‑chip memory, and a high I/O count. Its industrial temperature rating and surface‑mount FCBGA package make it appropriate for systems deployed in demanding environments where integration and reliability are key.

This device is well suited to engineering teams and procurement groups building complex digital systems that need scalable logic density, on‑chip RAM for memory‑heavy functions, and extensive external connectivity while maintaining compliance with RoHS requirements.

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