XC6VSX475T-2FFG1156C

The XC6VSX475T-2FFG1156C is a Virtex®-6 SXT field programmable gate array (FPGA) designed for systems that require high logic capacity, substantial on-chip memory and a large number of I/O connections. Its architecture supports dense digital integration and flexible I/O interfacing within a surface-mount 1156-FCBGA package.

Targeted at commercial-grade applications, this device provides a balance of integration and scalability for complex logic implementations operating within a 0 °C to 85 °C temperature range.

Key Features

• Core Capacity — Contains 476,160 logic elements to support complex combinational and sequential logic implementations.
• Programmable Logic Resources — Built to accommodate large-scale FPGA designs with extensive fabric resources for system integration.
• Embedded Memory — Approximately 39.2 Mbits of on-chip RAM for buffering, local storage and high-throughput data paths.
• I/O Density — 600 I/O pins to enable broad connectivity to external devices and multi-channel interfaces.
• Power Supply — Core voltage operating range from 950 mV to 1.05 V to match system power rails and design constraints.
• Package and Mounting — Supplied in a 1156-FCBGA package (35×35 mm) for surface-mount PCB assembly.
• Temperature and Grade — Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• High-density digital systems — Implement complex logic and large-scale state machines using the device's extensive logic element count and embedded RAM.
• Multi-channel I/O aggregation — Use the 600 I/O pins to consolidate multiple data lanes or peripheral interfaces on a single FPGA.
• On-board buffering and data handling — Leverage approximately 39.2 Mbits of embedded memory for packet buffering, FIFO staging and localized data storage.

Unique Advantages

• High logic density: 476,160 logic elements provide substantial capacity for large combinational and sequential designs, reducing the need for multiple devices.
• Significant embedded memory: Approximately 39.2 Mbits of on-chip RAM supports local buffering and reduces external memory dependencies.
• Extensive I/O capability: 600 I/O pins enable broad system interfacing and flexible connectivity options.
• Compact FCBGA package: The 1156-FCBGA (35×35) package offers a compact surface-mount solution for high-density PCB layouts.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to match standard commercial deployment requirements.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6VSX475T-2FFG1156C?

The XC6VSX475T-2FFG1156C positions itself as a high-capacity FPGA option for commercial applications that demand a combination of large logic resources, substantial embedded memory and a high I/O count. Its package and electrical specifications make it suitable for consolidated digital designs where board space and integration are priorities.

Design teams aiming to reduce board-level complexity and centralize processing and buffering functions can leverage this device's resources to create scalable, robust solutions with predictable operating conditions and environmental compliance.

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