XC6VSX475T-L1FF1156I

The XC6VSX475T-L1FF1156I is a Virtex®-6 SXT field programmable gate array (FPGA) IC designed for high-density digital designs. It provides 476,160 logic elements and approximately 39.2 Mbits of embedded memory, combined with up to 600 I/O pins in a 1156‑FCBGA package for compact, surface-mount integration.

Specified for industrial use, the device supports a core voltage supply range of 910 mV to 970 mV and an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

• Core / Architecture Virtex‑6 SXT FPGA architecture delivered in an industrial-grade device offering 476,160 logic elements for complex digital implementations.
• Embedded Memory Approximately 39.2 Mbits of on-chip RAM to support buffer, cache, and data-path requirements within the FPGA fabric.
• I/O Capacity Up to 600 I/O pins to accommodate high-density external interfacing and multi-channel connectivity needs.
• Power Core voltage supply range of 910 mV to 970 mV for system power planning and supply design.
• Package & Mounting 1156‑BBGA / 1156‑FCBGA package (1156‑FCBGA, 35 × 35 mm) in a surface-mount form factor for compact board-level deployment.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation Industrial-grade temperature range and high logic density support control, sequencing, and protocol handling in factory and process automation.
• High-Density I/O Systems With up to 600 I/O pins, suitable for systems requiring extensive sensor, actuator, or peripheral interfacing.
• Memory-Intensive FPGA Designs Approximately 39.2 Mbits of embedded RAM for buffering, data staging, and on-chip storage in complex digital pipelines.
• Compact Board-Level Integration 1156‑FCBGA surface-mount packaging enables high-functionality FPGA integration in space-constrained assemblies.

Unique Advantages

• High integration density: 476,160 logic elements allow consolidation of complex digital functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 39.2 Mbits of embedded RAM supports local data processing and reduces external memory dependence.
• Extensive external connectivity: Up to 600 I/O pins provide flexibility for multi-channel interfaces and high-pin-count peripherals.
• Industrial robustness: Rated for −40 °C to 100 °C operation and marked as industrial grade for reliable performance in demanding environments.
• Compact FCBGA package: 1156‑FCBGA (35 × 35 mm) surface-mount package helps save PCB area while enabling high-pin-count routing.
• Regulatory compliance: RoHS compliant for environmental and manufacturing alignment.

Why Choose XC6VSX475T-L1FF1156I?

The XC6VSX475T-L1FF1156I positions itself as a high-capacity, industrial-grade FPGA solution that combines a large logic fabric, considerable embedded memory, and extensive I/O in a compact 1156‑FCBGA surface-mount package. Its specified core voltage range and wide operating temperature window make it suitable for designs that require both integration density and industrial reliability.

This part is appropriate for design teams targeting complex digital systems that benefit from on-chip memory and high I/O counts, and for projects where board space and regulatory compliance are important considerations. The device’s specification set supports scalable implementations and long-term deployment in industrial applications.

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