XC6VSX475T-L1FF1759I

The XC6VSX475T-L1FF1759I is a Virtex®-6 SXT field programmable gate array from AMD, delivering high-density programmable logic and embedded memory in a 1759-ball FCBGA package. Engineered for industrial applications, it provides substantial logic resources, abundant I/O, and a wide operating temperature range for demanding system designs.

Key Features

• High logic density — 476,160 logic elements to support complex digital designs and large-scale integration on a single device.
• Embedded memory — approximately 39.2 Mbits of on-chip RAM for buffering, data processing, and state storage without external memory.
• Extensive I/O — 840 user I/O pins to accommodate wide parallel interfaces and dense connectivity requirements.
• Package and mounting — 1759-BBGA (FCBGA) package, supplier device package 1759-FCBGA (42.5 × 42.5 mm); surface-mount device for standard PCB assembly.
• Power supply — core voltage range specified at 910 mV to 970 mV for integration with target power-rail designs.
• Industrial temperature grade — rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Standards compliance — RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• High-density digital processing — large-scale logic capacity and on-chip RAM support compute-intensive FPGA designs.
• Industrial control systems — industrial-grade temperature range and robust I/O count for factory automation and control applications.
• Signal aggregation and interface bridging — abundant I/O allows consolidation of multiple interfaces into a single programmable device.

Unique Advantages

• Consolidated integration: 476,160 logic elements enable complex functions to be implemented on one device, reducing the need for multiple chips.
• On-chip memory capacity: Approximately 39.2 Mbits of embedded RAM supports buffering and on-device data processing without immediate reliance on external memory.
• Wide I/O capability: 840 I/O pins provide flexibility for multi-channel interfaces and parallel data paths.
• Industrial readiness: Rated operation from −40 °C to 100 °C suits applications that require extended temperature tolerance.
• Compact assembly footprint: 1759-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density board layouts.

Why Choose XC6VSX475T-L1FF1759I?

The XC6VSX475T-L1FF1759I offers a combination of high logic capacity, significant embedded memory, and extensive I/O in a single industrial-grade FPGA package. It is well suited to designers who need to implement large, complex functions while maintaining environmental robustness and a compact board footprint.

Manufactured by AMD, this device targets applications that demand scalability and reliability across industrial operating conditions. Its specifications make it an appropriate choice for teams focused on high-density programmable designs requiring on-chip memory and a broad set of I/O resources.

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