XC6VSX475T-2FFG1759E

The XC6VSX475T-2FFG1759E is a Virtex-6 SXT Field Programmable Gate Array from AMD, offering high-capacity programmable logic in an FCBGA package. It provides 476,160 logic elements, approximately 39.2 Mbits of embedded RAM, and up to 840 I/O pins for dense, configurable system designs.

Packaged as a 1759-FCBGA (42.5×42.5 mm) with surface-mount mounting and an extended-grade operating range (0 °C to 100 °C), this device is RoHS compliant and operates with a core supply range of 0.95 V to 1.05 V.

Key Features

• Core / Logic 476,160 logic elements to implement highly parallel, complex digital functions.
• Embedded Memory Approximately 39.2 Mbits of on-chip RAM for buffering, look-up tables, and memory-intensive algorithms.
• High I/O Count Up to 840 I/O pins to support wide bus interfaces and high-pin-count system interconnects.
• Power / Voltage Core voltage supply range of 0.95 V to 1.05 V, suitable for the device’s defined power envelope.
• Package & Mounting 1759-FCBGA package (42.5×42.5 mm), surface-mount format with 1759-BBGA/FCBGA package case designation for board-level integration.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for demanding environments.
• Environmental Compliance RoHS compliant, meeting common environmental material requirements.

Typical Applications

• High-density signal processing — Use the extensive logic and on-chip RAM to implement complex signal processing blocks and algorithm acceleration.
• High-pin-count interfacing — Leverage up to 840 I/O pins for multi-channel data aggregation, protocol bridging, and board-level connectivity.
• System integration and prototyping — Consolidate multiple functions into a single FPGA fabric to reduce component count and iterate system designs quickly.

Unique Advantages

• Large logic capacity: 476,160 logic elements enable implementation of substantial FPGA designs without immediate upscaling.
• Significant on-chip memory: Approximately 39.2 Mbits of embedded RAM supports buffering, deep pipelines, and memory-hungry functions on-chip.
• Extensive I/O resources: 840 I/Os provide flexibility for wide parallel interfaces and multiple simultaneous connections.
• Robust packaging: 1759-FCBGA (42.5×42.5 mm) surface-mount package supports dense PCB integration and thermal management considerations.
• Extended operating grade: Rated 0 °C to 100 °C for applications requiring broader-than-commercial temperature coverage.
• RoHS compliant: Meets environmental material restrictions for regulated markets.

Why Choose XC6VSX475T-2FFG1759E?

The XC6VSX475T-2FFG1759E positions itself as a high-capacity Virtex-6 SXT FPGA that balances large programmable logic resources, substantial on-chip memory, and a high I/O count in a compact 1759-FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for designs that require durability and regulatory material adherence.

This device is well suited to engineering teams developing complex, memory- and I/O-intensive FPGA designs that benefit from consolidating functions onto a single programmable device while maintaining well-defined electrical and packaging specifications.

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