XC6VSX475T-2FF1759C

The XC6VSX475T-2FF1759C is a Virtex®-6 SXT Field Programmable Gate Array from AMD designed for high-density digital integration. It provides a large logic capacity, abundant I/O, and substantial on-chip memory to support complex, I/O‑intensive designs.

Key device attributes include 476,160 logic elements, approximately 39.2 Mbits of embedded memory, 840 I/O pins, and a supplier device package of 1759-FCBGA (42.5×42.5). The device operates over a commercial temperature range and is RoHS compliant.

Key Features

• Core Logic Capacity  476,160 logic elements for implementing large-scale digital designs and complex custom logic blocks.
• Embedded Memory  Approximately 39.2 Mbits of on-chip RAM to support buffering, state machines, and data-intensive functions.
• I/O Resources  840 user I/O pins to accommodate high pin-count interfaces and dense connectivity requirements.
• Power Supply  Supported supply voltage range from 950 mV to 1.05 V for core operation.
• Package and Mounting  1759-FCBGA supplier device package (42.5×42.5) with surface-mount mounting type for compact system integration.
• Temperature and Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital systems  Implement large-scale, application-specific logic using the device’s high logic element count and embedded memory.
• I/O‑intensive designs  Support dense external interfacing and multiple parallel channels with 840 available I/O pins.
• Data buffering and on-chip storage  Use approximately 39.2 Mbits of on-chip RAM for temporary storage, FIFOs, and packet buffering within custom logic.

Unique Advantages

• High logic density: 476,160 logic elements enable implementation of complex functions and large state machines without external logic.
• Substantial embedded memory: Approximately 39.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 840 I/O pins allow flexible interfacing to multiple peripherals and high-channel-count systems.
• Compact FCBGA package: 1759-FCBGA (42.5×42.5) provides a high pin-count solution in a single surface-mount package for space-constrained boards.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in manufacturing.

Why Choose XC6VSX475T-2FF1759C?

The XC6VSX475T-2FF1759C delivers a combination of high logic capacity, generous on-chip memory, and extensive I/O within a single 1759-FCBGA surface-mount package. These attributes make it well suited to designers who need to consolidate complex digital functionality and high pin-count interfacing into a compact, commercial-grade FPGA.

Backed by AMD’s Virtex-6 SXT family lineage, this device offers a clear platform choice for projects that require scalability in logic, embedded memory, and connectivity while maintaining RoHS compliance and standard commercial operating conditions.

Request a quote or submit an inquiry to get pricing and availability for the XC6VSX475T-2FF1759C for your next design.